System packaging & integration for a swallowable capsule using a direct access sensor

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dc.contributor.authorJesudoss, Pio
dc.contributor.authorMathewson, Alan
dc.contributor.authorWright, William M. D.
dc.contributor.authorMcCaffrey, Colm
dc.contributor.authorOgurtsov, Vladimir I.
dc.contributor.authorTwomey, Karen
dc.contributor.authorStam, Frank
dc.contributor.funderEnterprise Irelanden
dc.contributor.funderHealth Research Boarden
dc.date.accessioned2016-05-16T10:59:31Z
dc.date.available2016-05-16T10:59:31Z
dc.date.issued2009-01
dc.date.updated2015-01-19T18:46:41Z
dc.description.abstractTechnological developments in biomedical microsystems are opening up new opportunities to improve healthcare procedures. Swallowable diagnostic capsules are an example of this. In this paper, a diagnostic capsule technology is described based on direct-access sensing of the Gastro Intestinal (GI) fluids throughout the GI tract. The objective of this paper is two-fold: i) develop a packaging method for a direct access sensor, ii) develop an encapsulation method to protect the system electronics. The integrity of the interconnection after sensor packaging and encapsulation is correlated to its reliability and thus of importance. The zero level packaging of the sensor was achieved by using a so called Flip Chip Over Hole (FCOH) method. This allowed the fluidic sensing media to interface with the sensor, while the rest of the chip including the electrical connections can be insulated effectively. Initial tests using Anisotropic Conductive Adhesive (ACA) interconnect for the FCOH demonstrated good electrical connections and functionality of the sensor chip. Also a preliminary encapsulation trial of the flip chipped sensor on a flexible test substrate has been carried out and showed that silicone encapsulation of the system is a viable option.en
dc.description.sponsorshipEnterprise Ireland (CFTD /05 / 122); Higher Education Authority (HEA PRTLIIV project NEMBES)en
dc.description.statusPeer revieweden
dc.description.urihttp://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=15927en
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationJesudoss, P., Mathewson, A., Wright, W. M. D., McCaffrey, C., Ogurtsov, V., Twomey, K. and Stam, F. (2009) 'System packaging and integration for a swallowable capsule using a direct access sensor', Microelectronics and Packaging Conference, 2009. EMPC 2009. European, 15-18 June 2009 2009. 1-4. IEEE.en
dc.identifier.endpage4en
dc.identifier.issn978-1-4244-4722-0
dc.identifier.other978-0-6152-9868-9
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/2576
dc.language.isoenen
dc.publisherIEEEen
dc.relation.ispartofMicroelectronics and Packaging Conference, 2009. EMPC 2009. European
dc.relation.urihttp://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5272917
dc.rights©2009 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectFlip chip over holeen
dc.subjectFCOHen
dc.subjectDirect-access sensoren
dc.subjectFlexible substrateen
dc.subjectAnisotropic Conductive Adhesiveen
dc.subjectACAen
dc.subjectPolysiloxaneen
dc.titleSystem packaging & integration for a swallowable capsule using a direct access sensoren
dc.typeConference itemen
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