LED flip-chip assembly with electroplated AuSn alloy

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dc.contributor.authorMaaskant, Pleun P.
dc.contributor.authorAkhter, Mahbub
dc.contributor.authorCordero, Nicolas
dc.contributor.authorCasey, Declan P.
dc.contributor.authorRohan, James F.
dc.contributor.authorRoycroft, Brendan J.
dc.contributor.authorCorbett, Brian M.
dc.contributor.funderEnterprise Irelanden
dc.date.accessioned2019-03-28T11:32:25Z
dc.date.available2019-03-28T11:32:25Z
dc.date.issued2005-04-11
dc.date.updated2019-03-28T11:22:20Z
dc.description.abstractInGaN based high brightness (HB)‐LED chips have been fabricated and bonded to substrates that were coated with electroplated Au/Sn/Au solder. The assemblies yielded a forward voltage of 5.6 V and an optical output power of 42 mW when tested at 1,000 mA bias. The electroluminescence distribution was mapped with a CCD camera to determine the current spreading into the p‐contact region. Computational fluid dynamics (CFD) was used to check the effect of non‐uniform current spreading on the thermal resistance of the assemblies. We show that a good knowledge of the non‐uniform heat generation is required to obtain accurate modelling results. The bond strength of the AuSn solder joints exceeded the norm, when shear tested according to MIL‐STD‐883E (method 2019.5).en
dc.description.sponsorshipEnterprise Ireland (Grant IF/2002/025)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationMaaskant, P. P., Akhter, M., Cordero, N., Casey, D. P., Rohan, J. F., Roycroft, B. J. and Corbett, B. M. (2005) 'LED flip-chip assembly with electroplated AuSn alloy', Physica Status Solidi (C), 2(7), pp. 2907-2911. doi:10.1002/pssc.200461566en
dc.identifier.doi10.1002/pssc.200461566
dc.identifier.endpage2911en
dc.identifier.issn1862-6351
dc.identifier.issn1610-1642
dc.identifier.issued7en
dc.identifier.journaltitlePhysica Status Solidi (C)en
dc.identifier.startpage2907en
dc.identifier.urihttps://hdl.handle.net/10468/7686
dc.identifier.volume2en
dc.language.isoenen
dc.publisherJohn Wiley & Sons, Inc.en
dc.relation.urihttps://doi.org/10.1002/pssc.200461566
dc.rights© 2005, WILEY‐VCH Verlag GmbH & Co. This is the accepted manuscript version of the following article: Maaskant, P. P., Akhter, M., Cordero, N., Casey, D. P., Rohan, J. F., Roycroft, B. J. and Corbett, B. M. (2005) 'LED flip-chip assembly with electroplated AuSn alloy', Physica Status Solidi (C), 2(7), pp. 2907-2911. doi:10.1002/pssc.200461566, which has been published in final form at https://doi.org/10.1002/pssc.200461566. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Self-Archiving.en
dc.subject78.66.Fden
dc.subject81.15.Pqen
dc.subject85.30.Deen
dc.subject85.60.Jben
dc.titleLED flip-chip assembly with electroplated AuSn alloyen
dc.typeArticle (peer-reviewed)en
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