Scientific and technical challenges in thermal transport and thermoelectric materials and devices
dc.contributor.author | O'Dwyer, Colm | |
dc.contributor.author | Chen, Renkun | |
dc.contributor.author | He, Jr-Hau | |
dc.contributor.author | Lee, Jaeho | |
dc.contributor.author | Razeeb, Kafil M. | |
dc.contributor.funder | Science Foundation Ireland | en |
dc.contributor.funder | Horizon 2020 | en |
dc.date.accessioned | 2017-03-01T10:04:02Z | |
dc.date.available | 2017-03-01T10:04:02Z | |
dc.date.issued | 2017-01-18 | |
dc.date.updated | 2017-02-27T10:56:38Z | |
dc.description.abstract | This paper considers the state-of-the-art and open scientific and technological questions in thermoelectric materials and devices, from phonon engineering and scattering methods, to new and complex materials and their thermoelectric behavior. The paper also describes recent approaches to create structural and compositional material systems designed to enhance the thermoelectric figure of merit and power factors. We also summarize and contextualize recent advances in the use of superlattice structures and porosity or roughness to influence phonon scattering mechanisms and detail some advances in integrated thermoelectric materials for generators and coolers for thermally stable photonic devices. | en |
dc.description.sponsorship | Science Foundation Ireland (Technology Innovation and Development Awards 13/TIDA/E2761 and 15/TIDA/2893; SFI Research Grant Number 14/IA/2581) | en |
dc.description.status | Peer reviewed | en |
dc.description.version | Published Version | en |
dc.format.mimetype | application/pdf | en |
dc.identifier.citation | O'Dwyer, C., Chen, R., He, J.-H., Lee, J.; Razeeb, K. M. (2017) 'Scientific and technical challenges in thermal transport and thermoelectric materials and devices', ECS Journal of Solid State Science and Technology, 6(3), pp. 58-64. doi: 10.1149/2.0091703jss | en |
dc.identifier.doi | 10.1149/2.0091703jss | |
dc.identifier.endpage | 64 | en |
dc.identifier.issn | 2162-8769 | |
dc.identifier.issued | 3 | en |
dc.identifier.journaltitle | ECS Journal of Solid State Science and Technology | en |
dc.identifier.startpage | 58 | en |
dc.identifier.uri | https://hdl.handle.net/10468/3713 | |
dc.identifier.volume | 6 | en |
dc.language.iso | en | en |
dc.publisher | Electrochemical Society | en |
dc.relation.project | info:eu-repo/grantAgreement/EC/H2020::RIA/644453/EU/Thermally Integrated Smart Photonics Systems/TIPS | en |
dc.rights | © 2017, the Authors. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial No Derivatives 4.0 License (CC BY-NC-ND, http://creativecommons.org/licenses/by-nc-nd/4.0/), which permits non-commercial reuse, distribution, and reproduction in any medium, provided the original work is not changed in anyway and is properly cited. For permission for commercial reuse, please email: oa@electrochem.org. [DOI:10.1149/2.0091703jss] All rights reserved. | en |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/4.0/ | en |
dc.subject | Phonon engineering | en |
dc.subject | Superlattice structures | en |
dc.subject | Scattering | en |
dc.title | Scientific and technical challenges in thermal transport and thermoelectric materials and devices | en |
dc.type | Article (peer-reviewed) | en |