3D interconnection by FIB assisted Pt deposition and electroless nickel deposition on the sides and edges of an I-Seed

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dc.contributor.authorRazeeb, Kafil M.
dc.contributor.authorNagle, Lorraine C.
dc.contributor.authorBarton, John
dc.contributor.authorTassie, Paul
dc.contributor.authorO'Flynn, Brendan
dc.contributor.authorRohan, James F.
dc.contributor.authorÓ Mathúna, S. Cian
dc.contributor.funderEuropean Commissionen
dc.date.accessioned2019-04-02T12:18:56Z
dc.date.available2019-04-02T12:18:56Z
dc.date.issued2006-05
dc.date.updated2019-04-02T12:13:15Z
dc.description.abstractThis paper reports on the development of a 3D interconnection process leading to the successful assembly of a five-layer 3-D 1mm cube module. This proof of concept module demonstrates the capability for successful integration and interconnection of commercial off the shelf components to fabricate functional modules in 1mm cube dimensions. It also demonstrates that use of established volume scale technologies like Flip-chip, dicing and patterning techniques are viable for fabricating these 1mm modules. The demonstrator consists of LED's bonded to the six sides of the 1mm cube, interconnected and powered up. The work will particularly report on two different processes to fabricate the interconnection pattern using direct Focused Ion Beam (FIB) assisted Pt deposition and electroless metal deposition, which again patterned by FIB. Uniform thickness of the deposit and excellent coverage on all six sides is achieved by electroless nickel deposition. Voltage current characterisation of the deposited Pt shows a resistivity value of 1864 +/- 100 mu Omega cm, whereas electroless Ni film shows a resistivity of 25 mu Omega cm due to boron inclusion. 100 nm An layer is deposited by chemical displacement reaction to enhance the conductivity and solderability of the film.en
dc.description.sponsorshipEuropean Commission (SOCIAL project)en
dc.description.statusPeer revieweden
dc.description.urihttps://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=10951en
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationRazeeb, K. M., Nagle, L., Barton, J., Tassie, P., Flynn, B. O., Rohan, J. and Ó Mathuna, C. (2006) '3D interconnection by FIB assisted Pt deposition and electroless nickel deposition on the sides and edges of an I-Seed'. 56th Electronic Components and Technology Conference 2006, San Diego, CA, USA, 30 May-2 June, pp. 1308-1311. doi: 10.1109/ECTC.2006.1645823en
dc.identifier.doi10.1109/ECTC.2006.1645823
dc.identifier.eissn2377-5726
dc.identifier.endpage1311en
dc.identifier.isbn1-4244-0152-6
dc.identifier.issn0569-5503
dc.identifier.journaltitle56th Electronic Components and Technology Conferenceen
dc.identifier.startpage1308en
dc.identifier.urihttps://hdl.handle.net/10468/7691
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.ispartof56th Electronic Components and Technology Conference 2006
dc.relation.urihttps://ieeexplore.ieee.org/document/1645823
dc.rights© 2006 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectNickelen
dc.subjectConductivityen
dc.subjectConductive filmsen
dc.subjectLeaden
dc.subjectAssemblyen
dc.subjectBondingen
dc.subjectIon beamsen
dc.subjectVoltageen
dc.subjectBoronen
dc.subjectGolden
dc.subjectAssemblingen
dc.subjectBoronen
dc.subjectElectroless depositionen
dc.subjectFocused ion beam technologyen
dc.subjectGolden
dc.subjectInterconnectionsen
dc.subjectNickelen
dc.subject3D interconnectionen
dc.subjectFIBen
dc.subjectI-Seeden
dc.subject3D cube moduleen
dc.subjectCommercial off the shelf componentsen
dc.subjectVolume scale technologiesen
dc.subjectFlip-chip dicingen
dc.subjectPatterning techniquesen
dc.subjectInterconnection patternen
dc.subjectDirect focused ion beamen
dc.subjectElectroless metal depositionen
dc.subjectVoltage current characterisationen
dc.subjectChemical displacement reactionen
dc.subject1 mmen
dc.subject100 nmen
dc.subjectPt-Nien
dc.title3D interconnection by FIB assisted Pt deposition and electroless nickel deposition on the sides and edges of an I-Seeden
dc.typeConference itemen
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