Photonic chiplet integration on optical interposer: Can hybrid bonding realize passive optical coupling?

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dc.contributor.authorHwang, How Yuanen
dc.contributor.authorO'Brien, Peteren
dc.contributor.funderScience Foundation Irelanden
dc.date.accessioned2024-10-31T12:50:07Z
dc.date.available2024-10-31T12:50:07Z
dc.date.issued2024-08-09en
dc.description.abstractSilicon photonic integrated circuits (Si-PIC) have come a long way since Soref et al. first proposed the use of silicon waveguides in the mid-1980s. However, even after four decades, packaging and integration of silicon photonic systems remain an under-studied area. Most of the packaging activities have been focusing on Fibre-to-PIC coupling, and how to achieve the lowest possible coupling loss. In this paper, we look beyond Fibre-to-PIC coupling, and explore the possibility of PIC-to-PIC integration through a 2.5D optical interposer. We opine that hybrid bonding approach could be a suitable technology for passive PIC-to-PIC integration because it is based on A. gapless (oxide fusion bonding), B. bump-less electrical connection (direct Cu-to-Cu) and C. has a relatively high bonding accuracy (∼ 0.5 µm). Two optical coupling approaches were studied — grating-to-grating coupling, and evanescent coupling based on inverted taper pair. FDTD was used in this activity — first to understand the feasibility of the two coupling approaches and then how potential bonding misalignment can affect PIC-to-PIC coupling losses.en
dc.description.sponsorshipScience Foundation Ireland (12/RC/2-276 P2)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationHwang, H. Y. and O'Brien, P. (2024) 'Photonic chiplet integration on optical interposer: Can hybrid bonding realize passive optical coupling?', 2024 Photonics & Electromagnetics Research Symposium (PIERS), Chengdu, China, 21-25 April 2024, pp. 1-7. https://doi.org/10.1109/PIERS62282.2024.10618259en
dc.identifier.doi10.1109/PIERS62282.2024.10618259en
dc.identifier.eissn2831-5804en
dc.identifier.endpage7en
dc.identifier.isbn979-8-3503-7590-9en
dc.identifier.isbn979-8-3503-7591-6en
dc.identifier.issn2831-5790en
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/16607
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.ispartof2024 Photonics & Electromagnetics Research Symposium (PIERS), Chengdu, China, 21-25 April 2024en
dc.rights© 2024, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectCouplingsen
dc.subjectIntegrated opticsen
dc.subjectOptical fiber sensorsen
dc.subjectOptical interconnectionsen
dc.subjectPackagingen
dc.subjectSilicon photonicsen
dc.subjectOptical couplingen
dc.titlePhotonic chiplet integration on optical interposer: Can hybrid bonding realize passive optical coupling?en
dc.typeConference itemen
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