Micro-transfer-printing for heterogeneous integration

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dc.contributor.authorCorbett, Brian
dc.contributor.authorLi, Zhi
dc.contributor.authorBuehler, K.
dc.contributor.authorNaumann, F.
dc.contributor.authorKrieger, U.
dc.contributor.authorWicht, S.
dc.contributor.authorBower, C. A.
dc.contributor.funderScience Foundation Irelanden
dc.contributor.funderHorizon 2020en
dc.date.accessioned2020-02-12T11:16:49Z
dc.date.available2020-02-12T11:16:49Z
dc.date.issued2019-06-13
dc.date.updated2020-02-12T11:08:24Z
dc.description.abstractMicro-transfer-printing is a key enabling technology for the heterogeneous integration of different materials and devices. The technique is particularly applicable to photonics where a typical system requires diverse arrays of components.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationCorbett, B., Li, Z., Buehler, K., Naumann, F., Krieger, U., Wicht, S. and Bower, C. A. (2019) 'Micro-transfer-printing for heterogeneous integration', 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Kanazawa, Japan, 21-25 May, p.34. doi: 10.23919/LTB-3D.2019.8735381en
dc.identifier.doi10.23919/LTB-3D.2019.8735381en
dc.identifier.endpage34en
dc.identifier.isbn978-4-9047-4307-2
dc.identifier.isbn978-1-7281-0387-7
dc.identifier.startpage34en
dc.identifier.urihttps://hdl.handle.net/10468/9636
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.projectinfo:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/en
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::ECSEL-IA/737465/EU/Pilot line for micro-transfer-printing of functional components on wafer level/MICROPRINCEen
dc.relation.urihttps://ieeexplore.ieee.org/document/8735381
dc.relation.urihttp://www.jsps191.org/ltb3d-2019/
dc.rights© 2019, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectIntegrated opticsen
dc.subjectMicroassemblingen
dc.subjectPrintingen
dc.subjectMicrotransfer-printingen
dc.subjectHeterogeneous integrationen
dc.subjectPhotonicsen
dc.subjectSiliconen
dc.subjectSubstratesen
dc.subjectSurface treatmenten
dc.subjectDielectricsen
dc.subjectPolymersen
dc.subjectIII-V semiconductor materialsen
dc.titleMicro-transfer-printing for heterogeneous integrationen
dc.typeConference itemen
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