Silicon photonic 2.5D integrated multi-chip module receiver

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dc.contributor.authorAbrams, Nathan C.
dc.contributor.authorCheng, Qixiang
dc.contributor.authorGlick, Madeleine
dc.contributor.authorJezzini, Moises
dc.contributor.authorMorrissey, Padraic
dc.contributor.authorO'Brien, Peter
dc.contributor.authorBergman, Keren
dc.date.accessioned2020-10-16T08:40:28Z
dc.date.available2020-10-16T08:40:28Z
dc.date.issued2020-09-10
dc.description.abstractWe demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers.en
dc.description.statusPeer revieweden
dc.description.versionPublished Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.articleidSF1L.3en
dc.identifier.citationAbrams, N. C., Cheng, Q., Glick, M., Jezzini, M., Morrissey, P., O'Brien, P. and Bergman, K. (2020) 'Silicon photonic 2.5D integrated multi-chip module receiver', 2020 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 10-15 May, SF1L.3 (2 pp).en
dc.identifier.endpage2en
dc.identifier.isbn978-1-7281-4418-4
dc.identifier.isbn978-1-943580-76-7
dc.identifier.issn2160-8989
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/10658
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.ispartof2020 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 10-15 May
dc.relation.urihttps://www.cleoconference.org/home/
dc.rights© 2020, the Authors. CLEO 2020 © 2020, OSA. All rights reserved.en
dc.subjectReceiversen
dc.subjectSiliconen
dc.subjectPhotonicsen
dc.subjectBandwidthen
dc.subjectOptical attenuatorsen
dc.subjectPrototypesen
dc.subjectWavelength division multiplexingen
dc.titleSilicon photonic 2.5D integrated multi-chip module receiveren
dc.typeConference itemen
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