Packaging technology for high power blue-green LEDs

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dc.contributor.authorAkhter, Mahbub
dc.contributor.authorMaaskant, Pleun P.
dc.contributor.authorCasey, Declan P.
dc.contributor.authorRohan, James F.
dc.contributor.authorCordero, Nicolas
dc.contributor.authorCorbett, Brian M.
dc.contributor.funderEnterprise Irelanden
dc.date.accessioned2019-04-02T11:08:22Z
dc.date.available2019-04-02T11:08:22Z
dc.date.issued2005-04
dc.date.updated2019-04-02T10:56:04Z
dc.description.abstractHigh brightness LEDs (HBLEDs) have been fabricated on GaN semiconductor material grown on sapphire substrate. These devices provide an optical output power in excess of 50 mW at a driving current of 1 amp. For this hi-h current application, large size (1.8 mm X 0.6 mm) GaN LEDs are flip-chip mounted onto a heat sink to provide a low thermal resistance path from the junction to the ambient. For the flip-chip mounting, a Au/Sn/Au solder and a Au/Au thermal compression bonding process have been optimized. The bond strength of the Au/Sn solder joints and the Au-Au bonds is measured through shear testing. Good bond strength results of 224 g/f for the Au/Sn/Au solder and 288 g/f for the solid Au bonds have been achieved. The thermal modeling of the assembly is done with a finite element analysis and the optimum design has been adopted for this high current application. At present these assemblies are under lifetime test and so far nearly 6000 hours of continuous operation has been achieved.en
dc.description.sponsorshipEnterprise Ireland (grant IF/2002/025)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationAkhter, M., Maaskant, P., Casey, D., Rohan, J., Cordero, N. and Corbett, B. (2005) 'Packaging technology for high power blue-green LEDs', Proceedings of SPIE, 5825, Opto-Ireland 2005: Optoelectronics, Photonic Devices, and Optical Networks, Dublin, Ireland, 4-6 April. doi:10.1117/12.605829en
dc.identifier.doi10.1117/12.605829
dc.identifier.eissn1996-756X
dc.identifier.endpage639en
dc.identifier.issn0277-786X
dc.identifier.journaltitleProceedings of SPIEen
dc.identifier.startpage634en
dc.identifier.urihttps://hdl.handle.net/10468/7689
dc.identifier.volume5825en
dc.language.isoenen
dc.publisherSociety of Photo-optical Instrumentation Engineers (SPIE)en
dc.relation.ispartofOpto-Ireland 2005: Optoelectronics, Photonic Devices, and Optical Networks, SPIE Proceedings
dc.rights© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE).en
dc.subjectHBLEDen
dc.subjectFlip-chip mountingen
dc.subjectSolderen
dc.subjectThermal compression bondingen
dc.titlePackaging technology for high power blue-green LEDsen
dc.typeConference itemen
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