On-chip optical interconnect on silicon by transfer printing

dc.contributor.authorLiu, Lei
dc.contributor.authorLoi, Ruggero
dc.contributor.authorRoycroft, Brendan
dc.contributor.authorO'Callaghan, James
dc.contributor.authorJustice, John
dc.contributor.authorTrindade, António José
dc.contributor.authorKelleher, Steven
dc.contributor.authorGocalińska, Agnieszka M.
dc.contributor.authorThomas, Kevin K.
dc.contributor.authorPelucchi, Emanuele
dc.contributor.authorBower, Christopher A.
dc.contributor.authorCorbett, Brian M.
dc.contributor.funderScience Foundation Irelanden
dc.date.accessioned2018-07-05T10:34:19Z
dc.date.available2018-07-05T10:34:19Z
dc.date.issued2018
dc.date.updated2018-07-05T09:20:03Z
dc.description.abstractOn-chip optical interconnects consisting of transfer-printed micro-LEDs and photodiodes are presented. Static and dynamic data transmission and bi-directional interconnect are demonstrated. The results show the potential for cost-effective and small form-factor on-chip opto-isolators.en
dc.description.statusNot peer revieweden
dc.description.urihttps://www.cleoconference.org/home/program/en
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.articleidSTh4B.1
dc.identifier.citationLiu, L., Loi, R., Roycroft, B., O'Callaghan, J., Justice, J., Trindade, A. J., Kelleher, S., Gocalinska, A., Thomas, K., Pelucchi, E., Bower, C. A. and Corbett, B. (2018) ‘On-chip optical interconnect on silicon by transfer printing’, CLEO: Science and Innovations 2018, San Jose, California, United States, 13–18 May. doi:10.1364/CLEO_SI.2018.STh4B.1en
dc.identifier.doi10.1364/CLEO_SI.2018.STh4B.1
dc.identifier.isbn978-1-943580-42-2
dc.identifier.urihttps://hdl.handle.net/10468/6414
dc.language.isoenen
dc.publisherOptical Society of Americaen
dc.relation.ispartofCLEO: Science and Innovations 2018
dc.relation.projectinfo:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/en
dc.rights© 2018, the Authors. Published by the Optical Society of America. All rights reserved.en
dc.subjectCoupling efficiencyen
dc.subjectDiode lasersen
dc.subjectLED displaysen
dc.subjectOptical interconnectsen
dc.subjectPhotonic integrationen
dc.subjectPolymer waveguidesen
dc.titleOn-chip optical interconnect on silicon by transfer printingen
dc.typeConference itemen
Files
Original bundle
Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
CLEO_paper_final.pdf
Size:
882.65 KB
Format:
Adobe Portable Document Format
Description:
Accepted Version
License bundle
Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
2.71 KB
Format:
Item-specific license agreed upon to submission
Description: