On-chip optical interconnect on silicon by transfer printing
dc.contributor.author | Liu, Lei | |
dc.contributor.author | Loi, Ruggero | |
dc.contributor.author | Roycroft, Brendan | |
dc.contributor.author | O'Callaghan, James | |
dc.contributor.author | Justice, John | |
dc.contributor.author | Trindade, António José | |
dc.contributor.author | Kelleher, Steven | |
dc.contributor.author | Gocalińska, Agnieszka M. | |
dc.contributor.author | Thomas, Kevin K. | |
dc.contributor.author | Pelucchi, Emanuele | |
dc.contributor.author | Bower, Christopher A. | |
dc.contributor.author | Corbett, Brian M. | |
dc.contributor.funder | Science Foundation Ireland | en |
dc.date.accessioned | 2018-07-05T10:34:19Z | |
dc.date.available | 2018-07-05T10:34:19Z | |
dc.date.issued | 2018 | |
dc.date.updated | 2018-07-05T09:20:03Z | |
dc.description.abstract | On-chip optical interconnects consisting of transfer-printed micro-LEDs and photodiodes are presented. Static and dynamic data transmission and bi-directional interconnect are demonstrated. The results show the potential for cost-effective and small form-factor on-chip opto-isolators. | en |
dc.description.status | Not peer reviewed | en |
dc.description.uri | https://www.cleoconference.org/home/program/ | en |
dc.description.version | Accepted Version | en |
dc.format.mimetype | application/pdf | en |
dc.identifier.articleid | STh4B.1 | |
dc.identifier.citation | Liu, L., Loi, R., Roycroft, B., O'Callaghan, J., Justice, J., Trindade, A. J., Kelleher, S., Gocalinska, A., Thomas, K., Pelucchi, E., Bower, C. A. and Corbett, B. (2018) ‘On-chip optical interconnect on silicon by transfer printing’, CLEO: Science and Innovations 2018, San Jose, California, United States, 13–18 May. doi:10.1364/CLEO_SI.2018.STh4B.1 | en |
dc.identifier.doi | 10.1364/CLEO_SI.2018.STh4B.1 | |
dc.identifier.isbn | 978-1-943580-42-2 | |
dc.identifier.uri | https://hdl.handle.net/10468/6414 | |
dc.language.iso | en | en |
dc.publisher | Optical Society of America | en |
dc.relation.ispartof | CLEO: Science and Innovations 2018 | |
dc.relation.project | info:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/ | en |
dc.rights | © 2018, the Authors. Published by the Optical Society of America. All rights reserved. | en |
dc.subject | Coupling efficiency | en |
dc.subject | Diode lasers | en |
dc.subject | LED displays | en |
dc.subject | Optical interconnects | en |
dc.subject | Photonic integration | en |
dc.subject | Polymer waveguides | en |
dc.title | On-chip optical interconnect on silicon by transfer printing | en |
dc.type | Conference item | en |