Electrodeposited thin-film micro-thermoelectric coolers with extreme heat flux handling and microsecond time response

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dc.check.date2022-01-04
dc.check.infoAccess to this article is restricted until 12 months after publication by request of the publisher.en
dc.contributor.authorCorbett, Simon
dc.contributor.authorGautam, D.
dc.contributor.authorLal, Swatchith
dc.contributor.authorYu, Kenny
dc.contributor.authorBalla, Naveen
dc.contributor.authorCunningham, Graeme
dc.contributor.authorRazeeb, Kafil M.
dc.contributor.authorEnright, Ryan
dc.contributor.authorMcCloskey, David
dc.contributor.funderHorizon 2020en
dc.contributor.funderScience Foundation Irelanden
dc.contributor.funderIrish Research Councilen
dc.date.accessioned2021-02-18T10:51:30Z
dc.date.available2021-02-18T10:51:30Z
dc.date.issued2021-01-04
dc.date.updated2021-02-18T09:49:08Z
dc.description.abstractThin-film thermoelectric coolers are emerging as a viable option for the on-chip temperature management of electronic and photonic integrated circuits. In this work, we demonstrate the record heat flux handling capability of electrodeposited Bi2Te3 films of 720(±60) W cm–2 at room temperature, achieved by careful control of the contact interfaces to reduce contact resistance. The characteristic parameters of a single leg thin-film devices were measured in situ, giving a Seebeck coefficient of S = −121(±6) μV K–1, thermal conductivity of κ = 0.85(±0.08) W m–1 K–1, electrical conductivity of σ = 5.2(±0.32) × 104 S m–1, and electrical contact resistivity of ∼10–11 Ω m2. These thermoelectric parameters lead to a material ZT = 0.26(±0.04), which, for our device structure, allowed a net cooling of ΔTmax = 4.4(±0.12) K. A response time of τ = 20 μs was measured experimentally. This work shows that with the correct treatment of contact interfaces, electrodeposited thin-film thermoelectrics can compete with more complicated and expensive technologies such as metal organic chemical vapor deposition (MOCVD) multilayers.en
dc.description.sponsorshipIrish Research Council (Grant EBPPG/2018/265); Science Foundation Ireland (SFI-16/IFB/4587)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationCorbett, S., Gautam, D., Lal, S., Yu, K., Balla, N., Cunningham, G., Razeeb, K. M., Enright, R. and McCloskey, D. (2021) 'Electrodeposited thin-film micro-thermoelectric coolers with extreme heat flux handling and microsecond time response', ACS Applied Materials and Interfaces, 13(1), pp. 1773-1782. doi: 10.1021/acsami.0c16614en
dc.identifier.doi10.1021/acsami.0c16614en
dc.identifier.eissn1944-8252
dc.identifier.endpage1782en
dc.identifier.issn1944-8244
dc.identifier.issued1en
dc.identifier.journaltitleACS Applied Materials and Interfacesen
dc.identifier.startpage1773en
dc.identifier.urihttps://hdl.handle.net/10468/11071
dc.identifier.volume13en
dc.language.isoenen
dc.publisherAmerican Chemical Societyen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::RIA/644453/EU/Thermally Integrated Smart Photonics Systems/TIPSen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::RIA/825114/EU/Smart Autonomous Multi Modal Sensors for Vital Signs Monitoring/SmartVistaen
dc.relation.projectinfo:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/en
dc.rights© 2021, American Chemical Society. This document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS Applied Materials and Interfaces, after technical editing by the publisher. To access the final edited and published work see: https://doi.org/10.1021/acsami.0c16614en
dc.subjectThermoelectric cooleren
dc.subjectElectrodepositionen
dc.subjectContact resistance CCD-thermoreflectanceen
dc.subjectHeat fluxen
dc.titleElectrodeposited thin-film micro-thermoelectric coolers with extreme heat flux handling and microsecond time responseen
dc.typeArticle (peer-reviewed)en
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