Advances in hybrid optics physical sensors for extreme environments

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Date
2010-05-13
Authors
Riza, Nabeel A.
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Society of Photo-optical Instrumentation Engineers (SPIE)
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Abstract
Highlighted are novel innovations in hybrid optical design physical sensors for extreme environments. Various hybrid design compositions are proposed that are suited for a particular sensor application. Examples includes combining freespace (wireless) and fiber-optics (wired) for gas turbine sensing and combining single crystal and sintered Silicon Carbide (SiC) materials for robust extreme environment Coefficent of Thermal Expansion (CTE) matched frontend probe design. Sensor signal processing also includes the hybrid theme where for example Black-Body radiation thermometry (pyrometry) is combined with laser interferometry to provide extreme temperature measurements. The hybrid theme also operates on the optical device level where a digital optical device such as a Digital Micromirror Device (DMD) is combined with an analog optical device such as an Electronically Controlled Variable Focal Length Lens (ECVFL) to deliver a smart and compressive Three Dimensional (3-D) imaging sensor for remote scene and object shape capture including both ambient light (passive) mode and active laser targeting and receive processing. Within a device level, the hybrid theme also operates via combined analog and digital control such as within a wavelength-coded variable optical delay line. These powerful hybrid design optical sensors have numerous applications in engineering and science applications from the military to the commercial/industrial sectors.
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Optical sensors , Temperature sensor , 3-D imaging sensor , Extreme environments , Liquid level , Sensors , Digital micromirror devices , Control systems , Analog electronics , Silicon carbide , Liquids , Remote sensing
Citation
Riza, N. A. (2010) 'Advances in hybrid optics physical sensors for extreme environments', Proceedings of SPIE, 7726, Optical Sensing and Detection, 77260L, 13 May, SPIE Photonics Europe, Brussels, Belgium. doi: 10.1117/12.855993
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© 2010 Society of Photo-Optical Instrumentation Engineers (SPIE). One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.