Monolithic MEMS filter banks on RFSOI front-end module

Abstract

This work is the first demonstration of a monolithic multiband RF front-end module (RF-FEM), integrating MEMS Lamb-wave filters and switches on 200mm RF silicon-on-insulator (RFSOI) foundry technology. Multiple MEMS filters with photolithography-defined frequencies coexist with RF components in the same wafer. This technology enables vertical integration of RF-FEM components for more compact System-on-Chip (SoC) architectures. The resulting RF-FEMs will then integrate in the same process multi-frequency filter banks, low noise amplifiers (LNAs), and switches, with a footprint reduction up to 50% compared to system-in-package (SiP) modules. The SoC architecture also simplifies the design of interconnection lines and impedance matching networks.