Monolithic MEMS filter banks on RFSOI front-end module
dc.contributor.author | Campanella, Humberto | |
dc.contributor.author | Qian, You | |
dc.contributor.author | Romero, Christian O. | |
dc.contributor.author | Giner, Joan | |
dc.contributor.author | Kumar, Rakesh | |
dc.date.accessioned | 2020-07-06T09:43:46Z | |
dc.date.available | 2020-07-06T09:43:46Z | |
dc.date.issued | 2020-01 | |
dc.date.updated | 2020-07-06T09:29:06Z | |
dc.description.abstract | This work is the first demonstration of a monolithic multiband RF front-end module (RF-FEM), integrating MEMS Lamb-wave filters and switches on 200mm RF silicon-on-insulator (RFSOI) foundry technology. Multiple MEMS filters with photolithography-defined frequencies coexist with RF components in the same wafer. This technology enables vertical integration of RF-FEM components for more compact System-on-Chip (SoC) architectures. The resulting RF-FEMs will then integrate in the same process multi-frequency filter banks, low noise amplifiers (LNAs), and switches, with a footprint reduction up to 50% compared to system-in-package (SiP) modules. The SoC architecture also simplifies the design of interconnection lines and impedance matching networks. | en |
dc.description.status | Peer reviewed | en |
dc.description.version | Accepted Version | en |
dc.format.mimetype | application/pdf | en |
dc.identifier.citation | Campanella, H., Qian, Y., Romero, C. O., Giner, J., Kumar, R. (2020) 'Monolithic MEMS filter banks on RFSOI front-end module', 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, BC, Canada, 18-22 January, pp. 218-221. doi: 10.1109/MEMS46641.2020.9056227 | en |
dc.identifier.doi | 10.1109/MEMS46641.2020.9056227 | en |
dc.identifier.eissn | 2160-1968 | |
dc.identifier.endpage | 221 | en |
dc.identifier.isbn | 978-1-7281-3581-6 | |
dc.identifier.isbn | 978-1-7281-3580-9 | |
dc.identifier.isbn | 978-1-7281-3582-3 | |
dc.identifier.issn | 1084-6999 | |
dc.identifier.startpage | 218 | en |
dc.identifier.uri | https://hdl.handle.net/10468/10210 | |
dc.language.iso | en | en |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | en |
dc.relation.uri | https://www.mems20.org/ | |
dc.rights | © 2020, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | en |
dc.subject | Channel bank filters | en |
dc.subject | Low noise amplifiers | en |
dc.subject | Microswitches | en |
dc.subject | Monolithic 3D integration | en |
dc.subject | Photolithography | en |
dc.subject | Radiofrequency filters | en |
dc.subject | Silicon-on-insulator | en |
dc.subject | System-on-chip | en |
dc.subject | Multiple MEMS filters | en |
dc.subject | Monolithic multiband RF front-end module | en |
dc.subject | RF silicon-on-insulator foundry technology | en |
dc.subject | MEMS Lamb-wave filters | en |
dc.subject | RFSOI front-end module | en |
dc.subject | RF-FEM components | en |
dc.subject | RF components | en |
dc.subject | MEMS filters | en |
dc.subject | RF front-end modules | en |
dc.subject | Lamb wave filters | en |
dc.subject | 5G | en |
dc.title | Monolithic MEMS filter banks on RFSOI front-end module | en |
dc.type | Conference item | en |