Monolithic MEMS filter banks on RFSOI front-end module
Romero, Christian O.
Institute of Electrical and Electronics Engineers (IEEE)
This work is the first demonstration of a monolithic multiband RF front-end module (RF-FEM), integrating MEMS Lamb-wave filters and switches on 200mm RF silicon-on-insulator (RFSOI) foundry technology. Multiple MEMS filters with photolithography-defined frequencies coexist with RF components in the same wafer. This technology enables vertical integration of RF-FEM components for more compact System-on-Chip (SoC) architectures. The resulting RF-FEMs will then integrate in the same process multi-frequency filter banks, low noise amplifiers (LNAs), and switches, with a footprint reduction up to 50% compared to system-in-package (SiP) modules. The SoC architecture also simplifies the design of interconnection lines and impedance matching networks.
Channel bank filters , Low noise amplifiers , Microswitches , Monolithic 3D integration , Photolithography , Radiofrequency filters , Silicon-on-insulator , System-on-chip , Multiple MEMS filters , Monolithic multiband RF front-end module , RF silicon-on-insulator foundry technology , MEMS Lamb-wave filters , RFSOI front-end module , RF-FEM components , RF components , MEMS filters , RF front-end modules , Lamb wave filters , 5G
Campanella, H., Qian, Y., Romero, C. O., Giner, J., Kumar, R. (2020) 'Monolithic MEMS filter banks on RFSOI front-end module', 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, BC, Canada, 18-22 January, pp. 218-221. doi: 10.1109/MEMS46641.2020.9056227
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