Electrodeposited thin-film micro-thermoelectric coolers with extreme heat flux handling and microsecond time response
Corbett, Simon; Gautam, D.; Lal, Swatchith; Yu, Kenny; Balla, Naveen; Cunningham, Graeme; Razeeb, Kafil M.; Enright, Ryan; McCloskey, David
Date:
2021-01-04
Copyright:
© 2021, American Chemical Society. This document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS Applied Materials and Interfaces, after technical editing by the publisher. To access the final edited and published work see: https://doi.org/10.1021/acsami.0c16614
Full text restriction information:
Access to this article is restricted until 12 months after publication by request of the publisher.
Restriction lift date:
2022-01-04
Citation:
Corbett, S., Gautam, D., Lal, S., Yu, K., Balla, N., Cunningham, G., Razeeb, K. M., Enright, R. and McCloskey, D. (2021) 'Electrodeposited thin-film micro-thermoelectric coolers with extreme heat flux handling and microsecond time response', ACS Applied Materials and Interfaces, 13(1), pp. 1773-1782. doi: 10.1021/acsami.0c16614
Abstract:
Thin-film thermoelectric coolers are emerging as a viable option for the on-chip temperature management of electronic and photonic integrated circuits. In this work, we demonstrate the record heat flux handling capability of electrodeposited Bi2Te3 films of 720(±60) W cm–2 at room temperature, achieved by careful control of the contact interfaces to reduce contact resistance. The characteristic parameters of a single leg thin-film devices were measured in situ, giving a Seebeck coefficient of S = −121(±6) μV K–1, thermal conductivity of κ = 0.85(±0.08) W m–1 K–1, electrical conductivity of σ = 5.2(±0.32) × 104 S m–1, and electrical contact resistivity of ∼10–11 Ω m2. These thermoelectric parameters lead to a material ZT = 0.26(±0.04), which, for our device structure, allowed a net cooling of ΔTmax = 4.4(±0.12) K. A response time of τ = 20 μs was measured experimentally. This work shows that with the correct treatment of contact interfaces, electrodeposited thin-film thermoelectrics can compete with more complicated and expensive technologies such as metal organic chemical vapor deposition (MOCVD) multilayers.
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