System packaging & integration for a swallowable capsule using a direct access sensor

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dc.contributor.author Jesudoss, Pio
dc.contributor.author Mathewson, Alan
dc.contributor.author Wright, William M. D.
dc.contributor.author McCaffrey, Colm
dc.contributor.author Ogurtsov, Vladimir I.
dc.contributor.author Twomey, Karen
dc.contributor.author Stam, Frank
dc.date.accessioned 2016-05-16T10:59:31Z
dc.date.available 2016-05-16T10:59:31Z
dc.date.issued 2009-01
dc.identifier.citation Jesudoss, P., Mathewson, A., Wright, W. M. D., McCaffrey, C., Ogurtsov, V., Twomey, K. and Stam, F. (2009) 'System packaging and integration for a swallowable capsule using a direct access sensor', Microelectronics and Packaging Conference, 2009. EMPC 2009. European, 15-18 June 2009 2009. 1-4. IEEE. en
dc.identifier.startpage 1 en
dc.identifier.endpage 4 en
dc.identifier.issn 978-1-4244-4722-0
dc.identifier.other 978-0-6152-9868-9
dc.identifier.uri http://hdl.handle.net/10468/2576
dc.description.abstract Technological developments in biomedical microsystems are opening up new opportunities to improve healthcare procedures. Swallowable diagnostic capsules are an example of this. In this paper, a diagnostic capsule technology is described based on direct-access sensing of the Gastro Intestinal (GI) fluids throughout the GI tract. The objective of this paper is two-fold: i) develop a packaging method for a direct access sensor, ii) develop an encapsulation method to protect the system electronics. The integrity of the interconnection after sensor packaging and encapsulation is correlated to its reliability and thus of importance. The zero level packaging of the sensor was achieved by using a so called Flip Chip Over Hole (FCOH) method. This allowed the fluidic sensing media to interface with the sensor, while the rest of the chip including the electrical connections can be insulated effectively. Initial tests using Anisotropic Conductive Adhesive (ACA) interconnect for the FCOH demonstrated good electrical connections and functionality of the sensor chip. Also a preliminary encapsulation trial of the flip chipped sensor on a flexible test substrate has been carried out and showed that silicone encapsulation of the system is a viable option. en
dc.description.sponsorship Enterprise Ireland (CFTD /05 / 122); Higher Education Authority (HEA PRTLIIV project NEMBES) en
dc.description.uri http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=15927 en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher IEEE en
dc.relation.ispartof Microelectronics and Packaging Conference, 2009. EMPC 2009. European
dc.relation.uri http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5272917
dc.rights ©2009 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.subject Flip chip over hole en
dc.subject FCOH en
dc.subject Direct-access sensor en
dc.subject Flexible substrate en
dc.subject Anisotropic Conductive Adhesive en
dc.subject ACA en
dc.subject Polysiloxane en
dc.title System packaging & integration for a swallowable capsule using a direct access sensor en
dc.type Conference item en
dc.internal.authorcontactother Frank Stam, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: frank.stam@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2015-01-19T18:46:41Z
dc.description.version Accepted Version en
dc.internal.rssid 276842127
dc.contributor.funder Enterprise Ireland en
dc.contributor.funder Health Research Board en
dc.description.status Peer reviewed en
dc.internal.copyrightchecked No. !!CORA!! Yes en
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Rimini, Italy en
dc.internal.IRISemailaddress frank.stam@tyndall.ie en


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