Photonic packaging: transforming silicon photonic integrated circuits into photonic devices

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dc.date.accessioned 2017-01-03T16:03:54Z
dc.date.available 2017-01-03T16:03:54Z
dc.date.issued 2016-12-15
dc.identifier.citation Carroll, L., Lee, J.-S., Scarcella, C., Gradkowski, K., Duperron, M., Lu, H., Zhao, Y., Eason, C., Morrissey, P., Rensing, M., Collins, S., Hwang, H. and O’Brien, P. (2016) 'Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices', Applied Sciences, 6(12), 426 (21 pp). doi:10.3390/app6120426 en
dc.identifier.volume 6 en
dc.identifier.issued 12 en
dc.identifier.startpage 426-1 en
dc.identifier.endpage 426-21 en
dc.identifier.issn 2076-3417
dc.identifier.uri http://hdl.handle.net/10468/3415
dc.identifier.doi 10.3390/app6120426
dc.description.abstract Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into a durable module. Photonic packaging of PICs is significantly more challenging, and currently orders of magnitude more expensive, than electronic packaging, because it calls for robust micron-level alignment of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Photonic packaging is perhaps the most significant bottleneck in the development of commercially relevant integrated photonic devices. This article describes how the key optical, electrical, and thermal requirements of Si-PIC packaging can be met, and what further progress is needed before industrial scale-up can be achieved. en
dc.description.sponsorship Science Foundation Ireland (SFI/12/RC/2276, SFI/14/ADV/RC2761); en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher MDPI en
dc.relation.uri http://www.mdpi.com/journal/applsci/special_issues/silicon_photonics
dc.rights © 2016 by the authors; licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/). en
dc.rights.uri http://creativecommons.org/licenses/by/4.0/
dc.subject Photonics packaging en
dc.subject Silicon photonics en
dc.subject Integrated optics en
dc.subject Optoelectronics en
dc.subject Photonic integrated circuits (PICs) en
dc.title Photonic packaging: transforming silicon photonic integrated circuits into photonic devices en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother Lee Carroll, Photonic Packaging Group, Tyndall National Institute, University College Cork, Cork, Ireland. E: lee.carroll@tyndall.ie en
dc.internal.availability Full text available en
dc.description.version Published Version en
dc.contributor.funder Science Foundation Ireland en
dc.contributor.funder European Commission en
dc.contributor.funder Seventh Framework Programme en
dc.contributor.funder Horizon 2020 Framework Programme en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Applied Sciences en
dc.internal.copyrightchecked !!CORA!! en
dc.relation.project info:eu-repo/grantAgreement/EC/FP7::SP1::ICT/318178/EU/Photonic Libraries And Technology for Manufacturing/PLAT4M en
dc.relation.project info:eu-repo/grantAgreement/EC/FP7::SP1::ICT/318704/EU/FDMA Access By Using Low-cost Optical Network Units in Silicon Photonics/FABULOUS en
dc.relation.project info:eu-repo/grantAgreement/EC/H2020::RIA/644453/EU/Thermally Integrated Smart Photonics Systems/TIPS en
dc.relation.project info:eu-repo/grantAgreement/EC/H2020::RIA/644798/EU/Early stage CARdio Vascular Disease Detection with Integrated Silicon Photonics/CARDIS en


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© 2016 by the authors; licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/). Except where otherwise noted, this item's license is described as © 2016 by the authors; licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/).
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