Characterization of germanium/silicon p-n junction fabricated by low temperature direct wafer bonding and layer exfoliation
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Published Version
Date
2012
Authors
Gity, Farzan
Byun, Ki Yeol
Lee, Ko-Hsin
Cherkaoui, Karim
Hayes, John M.
Morrison, Alan P.
Colinge, Cindy
Corbett, Brian M.
Journal Title
Journal ISSN
Volume Title
Publisher
AIP Publishing
Published Version
Abstract
The current transport across a p-Ge/n-Si diode structure obtained by direct wafer bonding and layer exfoliation is analysed. A low temperature anneal at 400 degrees C for 30 min was used to improve the forward characteristics of the diode with the on/off ratio at -1 V being > 8000. Post anneal, the transport mechanism has a strong tunnelling component. This fabrication technique using a low thermal budget (T <= 400 degrees C) is an attractive option for heterogeneous integration. (C) 2012 American Institute of Physics. (doi:10.1063/1.3688174)
Description
Keywords
Performance , Hydrogen , Photodetector , Sige , Germanium , Annealing , Elemental semiconductors , Tunneling , Leakage currents
Citation
Gity, F., Byun, K. Y., Lee, K.-H., Cherkaoui, K., Hayes, J. M., Morrison, A. P., Colinge, C. and Corbett, B. (2012) 'Characterization of germanium/silicon p–n junction fabricated by low temperature direct wafer bonding and layer exfoliation', Applied Physics Letters, 100(9), pp. 092102. doi: 10.1063/1.3688174
Copyright
© 2012 American Institute of Physics.This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. The following article appeared in Gity, F., Byun, K. Y., Lee, K.-H., Cherkaoui, K., Hayes, J. M., Morrison, A. P., Colinge, C. and Corbett, B. (2012) 'Characterization of germanium/silicon p–n junction fabricated by low temperature direct wafer bonding and layer exfoliation', Applied Physics Letters, 100(9), pp. 092102 and may be found at http://aip.scitation.org/doi/abs/10.1063/1.3688174