Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates

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dc.contributor.author Zheng, Liqiang
dc.contributor.author Mathewson, Alan
dc.contributor.author O'Flynn, Brendan
dc.contributor.author Hayes, Michael
dc.contributor.author Ó Mathúna, S. Cian
dc.date.accessioned 2011-12-19T14:39:38Z
dc.date.available 2011-12-19T14:39:38Z
dc.date.issued 2010-08
dc.identifier.citation Zheng, Liqiang; Mathewson, Alan; O'Flynn, Brendan; Hayes, Michael; Ó Mathúna, S. Cian (2010) Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates. In: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). Xi'an, China, 16-18 Aug. 2010. en
dc.identifier.startpage 860 en
dc.identifier.endpage 865 en
dc.identifier.isbn 978-1-4244-8140-8
dc.identifier.uri http://hdl.handle.net/10468/482
dc.identifier.doi 10.1109/ICEPT.2010.5582406
dc.description.abstract A comparison study was carried out between a wireless sensor node with a bare die flip-chip mounted and its reference board with a BGA packaged transceiver chip. The main focus is the return loss (S parameter S11) at the antenna connector, which was highly depended on the impedance mismatch. Modeling including the different interconnect technologies, substrate properties and passive components, was performed to simulate the system in Ansoft Designer software. Statistical methods, such as the use of standard derivation and regression, were applied to the RF performance analysis, to see the impacts of the different parameters on the return loss. Extreme value search, following on the previous analysis, can provide the parameters' values for the minimum return loss. Measurements fit the analysis and simulation well and showed a great improvement of the return loss from -5dB to -25dB for the target wireless sensor node. en
dc.description.sponsorship Science Foundation Ireland (ITOBO (398-CRP)); Science Foundation Ireland (CSET - Centre for Science, Engineering and Technology) en
dc.description.uri http://www.chinaphm.com/en/ICEPTHDP%202010.htm en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.relation.ispartof 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
dc.rights © 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.subject Ball grid arrays en
dc.subject Flip-chip devices en
dc.subject Integrated circuit interconnections en
dc.subject Radiofrequency integrated circuits en
dc.subject Transceivers en
dc.subject RF performance analysis en
dc.subject Antenna connector en
dc.subject Bare die flip-chip en
dc.subject Impedance mismatch en
dc.subject Interconnect technology en
dc.subject Passive components en
dc.subject Return loss en
dc.subject Wireless sensor node modelling en
dc.subject.lcsh Wireless sensor networks en
dc.subject.lcsh Flip chip technology en
dc.title Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates en
dc.type Conference item en
dc.internal.authorcontactother Liqiang Zheng, Heterogeneous Systems Integration, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: liqiang.zheng@tyndall.ie en
dc.internal.authorcontactother Alan Mathewson, Heterogeneous Systems Integration, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: alan.mathewson@tyndall.ie en
dc.internal.authorcontactother Brendan O'Flynn, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: brendan.oflynn@tyndall.ie en
dc.internal.authorcontactother Mike Hayes, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: michael.hayes@tyndall.ie en
dc.internal.authorcontactother Cian O Mathuna, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: cian.omathuna@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2011-12-19T12:38:29Z
dc.description.version Accepted Version en
dc.internal.rssid 119277735
dc.contributor.funder Science Foundation Ireland en
dc.description.status Peer reviewed en
dc.internal.copyrightchecked Yes IEEE - Romeo - © 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Xi'an, China en
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie en


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