Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates

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dc.contributor.authorZheng, Liqiang
dc.contributor.authorMathewson, Alan
dc.contributor.authorO'Flynn, Brendan
dc.contributor.authorHayes, Michael
dc.contributor.authorÓ Mathúna, S. Cian
dc.contributor.funderScience Foundation Irelanden
dc.date.accessioned2011-12-19T14:39:38Z
dc.date.available2011-12-19T14:39:38Z
dc.date.issued2010-08
dc.date.updated2011-12-19T12:38:29Z
dc.description.abstractA comparison study was carried out between a wireless sensor node with a bare die flip-chip mounted and its reference board with a BGA packaged transceiver chip. The main focus is the return loss (S parameter S11) at the antenna connector, which was highly depended on the impedance mismatch. Modeling including the different interconnect technologies, substrate properties and passive components, was performed to simulate the system in Ansoft Designer software. Statistical methods, such as the use of standard derivation and regression, were applied to the RF performance analysis, to see the impacts of the different parameters on the return loss. Extreme value search, following on the previous analysis, can provide the parameters' values for the minimum return loss. Measurements fit the analysis and simulation well and showed a great improvement of the return loss from -5dB to -25dB for the target wireless sensor node.en
dc.description.sponsorshipScience Foundation Ireland (ITOBO (398-CRP)); Science Foundation Ireland (CSET - Centre for Science, Engineering and Technology)en
dc.description.statusPeer revieweden
dc.description.urihttp://www.chinaphm.com/en/ICEPTHDP%202010.htmen
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationZheng, Liqiang; Mathewson, Alan; O'Flynn, Brendan; Hayes, Michael; Ó Mathúna, S. Cian (2010) Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates. In: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). Xi'an, China, 16-18 Aug. 2010.en
dc.identifier.doi10.1109/ICEPT.2010.5582406
dc.identifier.endpage865en
dc.identifier.isbn978-1-4244-8140-8
dc.identifier.startpage860en
dc.identifier.urihttps://hdl.handle.net/10468/482
dc.language.isoenen
dc.relation.ispartof2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
dc.rights© 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectBall grid arraysen
dc.subjectFlip-chip devicesen
dc.subjectIntegrated circuit interconnectionsen
dc.subjectRadiofrequency integrated circuitsen
dc.subjectTransceiversen
dc.subjectRF performance analysisen
dc.subjectAntenna connectoren
dc.subjectBare die flip-chipen
dc.subjectImpedance mismatchen
dc.subjectInterconnect technologyen
dc.subjectPassive componentsen
dc.subjectReturn lossen
dc.subjectWireless sensor node modellingen
dc.subject.lcshWireless sensor networksen
dc.subject.lcshFlip chip technologyen
dc.titleStatistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substratesen
dc.typeConference itemen
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