Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates

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Zheng, Liqiang
Mathewson, Alan
O'Flynn, Brendan
Hayes, Michael
Ó Mathúna, S. Cian
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A comparison study was carried out between a wireless sensor node with a bare die flip-chip mounted and its reference board with a BGA packaged transceiver chip. The main focus is the return loss (S parameter S11) at the antenna connector, which was highly depended on the impedance mismatch. Modeling including the different interconnect technologies, substrate properties and passive components, was performed to simulate the system in Ansoft Designer software. Statistical methods, such as the use of standard derivation and regression, were applied to the RF performance analysis, to see the impacts of the different parameters on the return loss. Extreme value search, following on the previous analysis, can provide the parameters' values for the minimum return loss. Measurements fit the analysis and simulation well and showed a great improvement of the return loss from -5dB to -25dB for the target wireless sensor node.
Ball grid arrays , Flip-chip devices , Integrated circuit interconnections , Radiofrequency integrated circuits , Transceivers , RF performance analysis , Antenna connector , Bare die flip-chip , Impedance mismatch , Interconnect technology , Passive components , Return loss , Wireless sensor node modelling
Zheng, Liqiang; Mathewson, Alan; O'Flynn, Brendan; Hayes, Michael; Ó Mathúna, S. Cian (2010) Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates. In: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). Xi'an, China, 16-18 Aug. 2010.
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