On-chip optical interconnect on silicon by transfer printing
Liu, Lei; Loi, Ruggero; Roycroft, Brendan; O'Callaghan, James; Justice, John; Trindade, António José; Kelleher, Steven; Gocalińska, Agnieszka M.; Thomas, Kevin K.; Pelucchi, Emanuele; Bower, Christopher A.; Corbett, Brian M.
Date:
2018
Copyright:
© 2018, the Authors. Published by the Optical Society of America. All rights reserved.
Citation:
Liu, L., Loi, R., Roycroft, B., O'Callaghan, J., Justice, J., Trindade, A. J., Kelleher, S., Gocalinska, A., Thomas, K., Pelucchi, E., Bower, C. A. and Corbett, B. (2018) ‘On-chip optical interconnect on silicon by transfer printing’, CLEO: Science and Innovations 2018, San Jose, California, United States, 13–18 May. doi:10.1364/CLEO_SI.2018.STh4B.1
Abstract:
On-chip optical interconnects consisting of transfer-printed micro-LEDs and photodiodes are presented. Static and dynamic data transmission and bi-directional interconnect are demonstrated. The results show the potential for cost-effective and small form-factor on-chip opto-isolators.
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