Development of 808 nm laser-assisted-bonding (LAB) for photonic system-in-package integration
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Accepted Version
Date
2024-09-23
Authors
Shortiss, Kevin
Hwang, How Yuan
Parra-Cetina, Josue
Seyfried, Moritz
O'Brien, Peter
Journal Title
Journal ISSN
Volume Title
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published Version
Abstract
We describe a versatile laser-assisted bonding (LAB) system for photonic system-in-package integration using an 808 nm laser. This paper details the LAB process for flip chip bonding of Si and InP PICs onto glass interposers.
Description
Keywords
Technological innovation , System-in-package , Lasers , Glass , Silicon , Flip-chip devices , Bonding
Citation
Shortiss, K., Hwang, H. Y., Parra-Cetina, J., Seyfried, M. and O'Brien, P. (2024) 'Development of 808 nm laser-assisted-bonding (LAB) for photonic system-in-package integration', 2024 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), Incheon, Republic of Korea, 4-9 August 2024, pp. 1-2. https://doi.org/10.1109/CLEO-PR60912.2024.10676851
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© 2024, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.