Development of 808 nm laser-assisted-bonding (LAB) for photonic system-in-package integration

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dc.contributor.authorShortiss, Kevinen
dc.contributor.authorHwang, How Yuanen
dc.contributor.authorParra-Cetina, Josueen
dc.contributor.authorSeyfried, Moritzen
dc.contributor.authorO'Brien, Peteren
dc.contributor.funderHorizon 2020en
dc.date.accessioned2024-10-31T13:06:07Z
dc.date.available2024-10-31T13:06:07Z
dc.date.issued2024-09-23en
dc.description.abstractWe describe a versatile laser-assisted bonding (LAB) system for photonic system-in-package integration using an 808 nm laser. This paper details the LAB process for flip chip bonding of Si and InP PICs onto glass interposers.en
dc.description.sponsorshipHorizon 2020 (10101673)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationShortiss, K., Hwang, H. Y., Parra-Cetina, J., Seyfried, M. and O'Brien, P. (2024) 'Development of 808 nm laser-assisted-bonding (LAB) for photonic system-in-package integration', 2024 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), Incheon, Republic of Korea, 4-9 August 2024, pp. 1-2. https://doi.org/10.1109/CLEO-PR60912.2024.10676851en
dc.identifier.doihttps://doi.org/10.1109/CLEO-PR60912.2024.10676851en
dc.identifier.eissn2997-7037en
dc.identifier.endpage2en
dc.identifier.isbn979-8-3503-7207-6en
dc.identifier.isbn979-8-3503-7208-3en
dc.identifier.issn2997-7053en
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/16608
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.ispartof2024 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), Incheon, Republic of Korea, 4-9 August 2024en
dc.rights© 2024, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectTechnological innovationen
dc.subjectSystem-in-packageen
dc.subjectLasersen
dc.subjectGlassen
dc.subjectSiliconen
dc.subjectFlip-chip devicesen
dc.subjectBondingen
dc.titleDevelopment of 808 nm laser-assisted-bonding (LAB) for photonic system-in-package integrationen
dc.typeConference itemen
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