Automating photonic systems-in-package assembly for high performance glass interposers
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Date
2024
Authors
Shortiss, Kevin
Hwang, How Yuan
Parra, Josue
Butler, Sharon
Ghomashi, Mohammadamin
Li, Yanlu
Noell, Wilfried
Seyfried, Moritz
O’Brien, Peter
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Abstract
Interest in high performance glass interposers has been growing, due to the advantages which have been demonstrated over standard silicon interposers. In this paper, we demonstrate fully automated micro-optics and laser sub-assembly alignment and laser-assisted bonding processes which are compatible with glass interposers.
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Keywords
High performance glass interposers
Citation
Shortiss, K., Hwang, H. Y., Parra, J., Butler, S., Wang, H.-C., Ghomashi, M., Li, Y., Noell, W., Seyfried, M. and O’Brien, P. (2024) 'Automating photonic systems-in-package assembly for high performance glass interposers', ECOC 2024, 50th European Conference on Optical Communication, Frankfurt, Germany, 22-26 September.
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© 2024, the Authors.