Automating photonic systems-in-package assembly for high performance glass interposers

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dc.contributor.authorShortiss, Kevinen
dc.contributor.authorHwang, How Yuanen
dc.contributor.authorParra, Josueen
dc.contributor.authorButler, Sharonen
dc.contributor.authorGhomashi, Mohammadaminen
dc.contributor.authorLi, Yanluen
dc.contributor.authorNoell, Wilfrieden
dc.contributor.authorSeyfried, Moritzen
dc.contributor.authorO’Brien, Peteren
dc.contributor.funderHorizon 2020en
dc.date.accessioned2025-03-03T09:40:32Z
dc.date.available2025-03-03T09:40:32Z
dc.date.issued2024en
dc.description.abstractInterest in high performance glass interposers has been growing, due to the advantages which have been demonstrated over standard silicon interposers. In this paper, we demonstrate fully automated micro-optics and laser sub-assembly alignment and laser-assisted bonding processes which are compatible with glass interposers.en
dc.description.sponsorshipHorizon 2020 (10101673)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationShortiss, K., Hwang, H. Y., Parra, J., Butler, S., Wang, H.-C., Ghomashi, M., Li, Y., Noell, W., Seyfried, M. and O’Brien, P. (2024) 'Automating photonic systems-in-package assembly for high performance glass interposers', ECOC 2024, 50th European Conference on Optical Communication, Frankfurt, Germany, 22-26 September.en
dc.identifier.endpage4en
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/17139
dc.language.isoenen
dc.relation.ispartofECOC 2024, 50th European Conference on Optical Communication, Frankfurt, Germany, 22-26 September 2024en
dc.relation.project10101673en
dc.rights© 2024, the Authors.en
dc.subjectHigh performance glass interposersen
dc.titleAutomating photonic systems-in-package assembly for high performance glass interposersen
dc.typeConference itemen
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