Ultra-low loss integrated magnetics platform for high frequency power delivery networks

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dc.check.date2022-05-21
dc.check.infoAccess to this article is restricted until 24 months after publication by request of the publisher.en
dc.contributor.authorPodder, Pranay
dc.contributor.authorPavlovic, Zoran
dc.contributor.authorMasood, Ansar
dc.contributor.authorWei, Guannan
dc.contributor.authorLordan, Daniel
dc.contributor.authorO'Driscoll, Séamus
dc.contributor.authorPeters, Nicolas
dc.contributor.authorPeng, Lulu
dc.contributor.authorAli, Zishan
dc.contributor.authorSelvaraj, Lawrence
dc.contributor.authorCheng, Chor Shu
dc.contributor.authorO'Mathuna, Cian
dc.contributor.authorMcCloskey, Paul
dc.date.accessioned2021-08-19T08:46:40Z
dc.date.available2021-08-19T08:46:40Z
dc.date.issued2020-05-21
dc.description.abstractThe future smart systems are envisaged to continue shrinking in size and weight, while integrating more features and functionalities, leading to significant increase in power density and efficiency requirements. In addition, devices such as mobile phones and tablet computers require a large reduction in electronic component height. While SMT chip power inductors may have thicknesses as low as 0.6mm; thin film power inductors offer an incremental height of ~50μm. This paper introduces an ultra-low loss integrated magnetics platform for the next generation power systems on-chip (PwrSoC) and in-package (PwrSiP) applications. The integrated magnetics-on-silicon inductors and transformers have been designed, fabricated using conventional CMOS fabrication processes, and characterized, demonstrating industry leading performance metrics.en
dc.description.statusPeer revieweden
dc.description.versionPublished Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationPodder, P., Pavlovic, Z., Masood, A., Wei, G., Lordan, D., O'Driscoll, S., Peters, N., Peng, L., Ali, Z., Selvaraj, L., Cheng, C. S., O'Mathuna, C. and McCloskey, P. (2020) 'Ultra-low loss integrated magnetics platform for high frequency power delivery networks', CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, Berlin, Germany, 24-26 March, pp. 81-84. Available at: https://ieeexplore.ieee.org/abstract/document/9097660 (Accessed: 19 August 2021)en
dc.identifier.endpage84en
dc.identifier.isbn978-3-8007-5225-6
dc.identifier.startpage81en
dc.identifier.urihttps://hdl.handle.net/10468/11757
dc.language.isoenen
dc.publisherVDE Verlagen
dc.relation.urihttps://www.vde-verlag.de/proceedings-de/455225014.html
dc.relation.urihttps://ieeexplore.ieee.org/abstract/document/9097660
dc.rights© 2020, VDE Verlag. All rights reserved.en
dc.subjectSmart systemsen
dc.subjectUltra-low loss integrated magnetics platformen
dc.subjectPower systems on-chip (PwrSoC)en
dc.subjectPower systems in-package (PwrSiP)en
dc.titleUltra-low loss integrated magnetics platform for high frequency power delivery networksen
dc.typeConference itemen
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