Formation of sub-7 nm feature size PS-b-P4VP block copolymer structures by solvent vapour process

Loading...
Thumbnail Image
Files
905110_1.pdf(652.93 KB)
Published Version
Date
2014-03-27
Authors
Chaudhari, Atul
Ghoshal, Tandra
Shaw, Matthew T.
Cummins, Cian
Borah, Dipu
Holmes, Justin D.
Morris, Michael A.
Journal Title
Journal ISSN
Volume Title
Publisher
SPIE
Published Version
Research Projects
Organizational Units
Journal Issue
Abstract
The nanometer range structure produced by thin films of diblock copolymers makes them a great of interest as templates for the microelectronics industry. We investigated the effect of annealing solvents and/or mixture of the solvents in case of symmetric Poly (styrene-block-4vinylpyridine) (PS-b-P4VP) diblock copolymer to get the desired line patterns. In this paper, we used different molecular weights PS-b-P4VP to demonstrate the scalability of such high χ BCP system which requires precise fine-tuning of interfacial energies achieved by surface treatment and that improves the wetting property, ordering, and minimizes defect densities. Bare Silicon Substrates were also modified with polystyrene brush and ethylene glycol self-assembled monolayer in a simple quick reproducible way. Also, a novel and simple in situ hard mask technique was used to generate sub-7nm Iron oxide nanowires with a high aspect ratio on Silicon substrate, which can be used to develop silicon nanowires post pattern transfer.
Description
Keywords
Block copolymers , Solvent annealing , High χ polymers , Polymer brushes , Metal oxide inclusion , Annealing , Iron , Microelectronics , Nanofibers , Nanotechnology , Oxides , Self-assembled monolayers , Silicon , Thin films
Citation
Chaudhari, A., Ghoshal, T., Shaw M. T., Cummins C., Borah, D. Holmes, J. D., Morris, M. A. "Formation of sub-7 nm feature size PS-b-P4VP block copolymer structures by solvent vapour process ", Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 905110 (March 27, 2014); doi:10.1117/12.2046044; http://dx.doi.org/10.1117/12.2046044
Copyright
© 2014 Society of Photo Optical Instrumentation Engineers (SPIE). One print or electronic copy may be made for personal use only. Systematic electronic or print reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.