Low resistivity Pt interconnects developed by electron beam assisted deposition using novel gas injector system

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Date
2012-07-02
Authors
Dias, R. J.
O'Regan, Colm
Thrompenaars, P.
Romano-Rodriguez, A.
Holmes, Justin D.
Mulder, J. J. L.
Petkov, Nikolay
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IOP Publishing
Published Version
10.1088/1742-6596/371/1/012038
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Abstract
Electron beam-induced deposition (EBID) is a direct write process where an electron beam locally decomposes a precursor gas leaving behind non-volatile deposits. It is a fast and relatively in-expensive method designed to develop conductive (metal) or isolating (oxide) nanostructures. Unfortunately the EBID process results in deposition of metal nanostructures with relatively high resistivity because the gas precursors employed are hydrocarbon based. We have developed deposition protocols using novel gas-injector system (GIS) with a carbon free Pt precursor. Interconnect type structures were deposited on preformed metal architectures. The obtained structures were analysed by cross-sectional TEM and their electrical properties were analysed ex-situ using four point probe electrical tests. The results suggest that both the structural and electrical characteristics differ significantly from those of Pt interconnects deposited by conventional hydrocarbon based precursors, and show great promise for the development of low resistivity electrical contacts.
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Keywords
Electron beam-induced deposition , EBID , Low resistivity , Nanostructures , Functional materials , Electron microscopy
Citation
Dias, R. J., Regan, C. O., Thrompenaars, P., Romano-Rodriguez, A., Holmes, J. D., Mulder, J. J. L. & Petkov, N. 2012. Low resistivity Pt interconnects developed by electron beam assisted deposition using novel gas injector system. Journal of Physics: Conference Series, 371, 012038. http://stacks.iop.org/1742-6596/371/i=1/a=012038
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URI
https://hdl.handle.net/10468/2591
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Chemistry - Conference Items
Tyndall National Institute - Conference Items
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© The authors, 2012. Published under licence in Journal of Physics: Conference Series by IOP Publishing Ltd. CC-BY Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the authors and the title of the work, journal citation and DOI.