Pluggable silicon photonic MEMS switch package for data centre
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Accepted version
Date
2018-12
Authors
Hwang, How Yuan
Lee, Jun Su
Henriksson, Johannes
Kwon, Kyungmok
Seok, Tae Joon
Wu, Ming C.
O'Brien, Peter A.
Journal Title
Journal ISSN
Volume Title
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published Version
Abstract
Consumers' thirst for data has led to the development of various silicon photonic switching devices that are highly scalable while maintaining their relatively compact form factor at the same time. This demands a paradigm shift in the way these devices are being packaged, as optical and electrical ports are involved. In this article, we proposed a pluggable silicon photonic MEMS switch package with passive optical coupling assembly. This approach shifts fibre coupling away from the package, keeping it “purely electrical.” The pluggable concept is separately demonstrated through spring contacted hybrid assembly and pairs of vertically stack surface gratings. Insertion losses are comparable to planar fibre-to-grating coupling, with relatively broadband transmission and assembly tolerance.
Description
Keywords
Diffraction gratings , Elemental semiconductors , Integrated optics , Micro-optomechanical devices , Optical couplers , Optical fabrication , Optical losses , Optical switches , Photonic switching systems , Silicon , Pluggable silicon photonic MEMS switch package , Data centre , Silicon photonic switching devices , Optical ports , Electrical ports , Passive optical coupling assembly , Compact form factor , Paradigm shift , Spring contacted hybrid assembly , Vertically stack surface gratings , Broadband transmission , Insertion losses , Assembly tolerance , Optical fibers , Photonics , Optical coupling , Couplings
Citation
Hwang, H. Y., Lee, J. S., Henriksson, J., Kwon, K., Seok, T. J., Wu, M. C. and O’Brien, P. (2018) 'Pluggable Silicon Photonic MEMS Switch Package for Data Centre, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), Singapore, 4-7 December, pp. 46-49. doi: 10.1109/EPTC.2018.8654270
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