Pluggable silicon photonic MEMS switch package for data centre

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dc.contributor.authorHwang, How Yuan
dc.contributor.authorLee, Jun Su
dc.contributor.authorHenriksson, Johannes
dc.contributor.authorKwon, Kyungmok
dc.contributor.authorSeok, Tae Joon
dc.contributor.authorWu, Ming C.
dc.contributor.authorO'Brien, Peter A.
dc.contributor.funderNational Science Foundationen
dc.contributor.funderScience Foundation Irelanden
dc.date.accessioned2019-04-12T11:24:04Z
dc.date.available2019-04-12T11:24:04Z
dc.date.issued2018-12
dc.date.updated2019-04-12T11:14:56Z
dc.description.abstractConsumers' thirst for data has led to the development of various silicon photonic switching devices that are highly scalable while maintaining their relatively compact form factor at the same time. This demands a paradigm shift in the way these devices are being packaged, as optical and electrical ports are involved. In this article, we proposed a pluggable silicon photonic MEMS switch package with passive optical coupling assembly. This approach shifts fibre coupling away from the package, keeping it “purely electrical.” The pluggable concept is separately demonstrated through spring contacted hybrid assembly and pairs of vertically stack surface gratings. Insertion losses are comparable to planar fibre-to-grating coupling, with relatively broadband transmission and assembly tolerance.en
dc.description.sponsorshipNational Science Foundation (Center for Integrated Access Network (CIAN), United States);en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationHwang, H. Y., Lee, J. S., Henriksson, J., Kwon, K., Seok, T. J., Wu, M. C. and O’Brien, P. (2018) 'Pluggable Silicon Photonic MEMS Switch Package for Data Centre, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), Singapore, 4-7 December, pp. 46-49. doi: 10.1109/EPTC.2018.8654270en
dc.identifier.doi10.1109/EPTC.2018.8654270en
dc.identifier.endpage49en
dc.identifier.isbn978-1-5386-7668-4
dc.identifier.isbn978-1-5386-7667-7
dc.identifier.isbn978-1-5386-7669-1
dc.identifier.journaltitle2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)en
dc.identifier.startpage46en
dc.identifier.urihttps://hdl.handle.net/10468/7759
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.ispartof2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
dc.relation.projectinfo:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/en
dc.relation.urihttps://ieeexplore.ieee.org/document/8654270
dc.rights© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectDiffraction gratingsen
dc.subjectElemental semiconductorsen
dc.subjectIntegrated opticsen
dc.subjectMicro-optomechanical devicesen
dc.subjectOptical couplersen
dc.subjectOptical fabricationen
dc.subjectOptical lossesen
dc.subjectOptical switchesen
dc.subjectPhotonic switching systemsen
dc.subjectSiliconen
dc.subjectPluggable silicon photonic MEMS switch packageen
dc.subjectData centreen
dc.subjectSilicon photonic switching devicesen
dc.subjectOptical portsen
dc.subjectElectrical portsen
dc.subjectPassive optical coupling assemblyen
dc.subjectCompact form factoren
dc.subjectParadigm shiften
dc.subjectSpring contacted hybrid assemblyen
dc.subjectVertically stack surface gratingsen
dc.subjectBroadband transmissionen
dc.subjectInsertion lossesen
dc.subjectAssembly toleranceen
dc.subjectOptical fibersen
dc.subjectPhotonicsen
dc.subjectOptical couplingen
dc.subjectCouplingsen
dc.titlePluggable silicon photonic MEMS switch package for data centreen
dc.typeConference itemen
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