Advanced ultrathin spray coating process technology for heterogeneous integration applications

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dc.contributor.authorRimböck, Johannaen
dc.contributor.authorErtl, Stefanen
dc.contributor.authorRamaswamy, Prasannaen
dc.contributor.authorFarrell, Alexen
dc.contributor.authorUzun, Alien
dc.contributor.authorPires, Marianaen
dc.contributor.authorCorbett, Brianen
dc.contributor.authorLoi, Ruggeroen
dc.contributor.authorVarga, Ksenijaen
dc.contributor.authorOssieur, Peteren
dc.contributor.funderHorizon 2020en
dc.date.accessioned2025-01-22T09:52:11Z
dc.date.available2025-01-22T09:52:11Z
dc.date.issued2024-10-15en
dc.description.abstractIn this work the spray coating deposition of thin and ultrathin homogeneous layers of Divinylsiloxane-bis-benzocyclobutene (DVS-BCB or BCB) is presented. Film thicknesses from 200 nm down to 5 nm are achieved. The layer thickness is assessed using Variable Angle Spectroscopy Ellipsometry (VASE), which allows for nondestructive high precision thickness measurement. Multiple positions mapping provides information about thickness distribution across the substrate. This spray coating process study reveals that the layer deposition for thicker films (> 75 nm) is mainly driven by hardware parameters. For thinner layers, additional material solution adjustment (dilution) is necessary. For each studied layer thickness (200 nm, 35 nm and 5 nm), batches of 25 wafers are prepared aiming to study the wafer-to-wafer process stability necessary for successful industrial application. Finally, the thin and ultrathin BCB layers are used for different bonding technologies, i.e. die-to-wafer permanent adhesive bonding as well as micro transfer printing (μ Tp). Multiple electronic integrated circuits (EICs) and quantum dot lasers (QDLs) devices are heterogeneously integrated to Si/SiO2/BCB wafers using the layers with thicknesses of 35 nm and 5 nm. For all devices a 100 % process yield is obtained.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationRimböck, J., Ertl, S., Ramaswamy, P., Farrell, A., Uzun, A., Pires, M., Corbett, B., Loi, R., Varga, K. and Ossieur, P. (2024) 'Advanced ultrathin spray coating process technology for heterogeneous integration applications', 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, Germany, 11-13 September, pp. 1-9. https://doi.org/10.1109/ESTC60143.2024.10712128en
dc.identifier.doihttps://doi.org/10.1109/ESTC60143.2024.10712128en
dc.identifier.eissn2687-9727en
dc.identifier.endpage9en
dc.identifier.isbn979-8-3503-9036-0en
dc.identifier.isbn979-8-3503-9037-7en
dc.identifier.issn2687-9700en
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/16869
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.ispartof2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, Germany, 11-13 Septemberen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::IA/825453/EU/Micro assembled Terabit/s capable optical transceivers for Datacom applications/Caladanen
dc.rights© 2024, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectUltrathin layeren
dc.subjectSpray coatingen
dc.subjectMicro transfer printing μ TPen
dc.subjectEllipsometryen
dc.subjectAdhesive bondingen
dc.subjectDie-to-wafer bondingen
dc.subjectSilicon photonicsen
dc.subjectElectronic integrated circuits EICsen
dc.subjectQuantum dot lasers QDLen
dc.titleAdvanced ultrathin spray coating process technology for heterogeneous integration applicationsen
dc.typeConference itemen
oaire.citation.volume9en
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