Cryogenic packaging for scalable hybrid quantum PICs
dc.contributor.author | Bernson, Robert | en |
dc.contributor.author | Witte, Alexander | en |
dc.contributor.author | Clark, Genevieve | en |
dc.contributor.author | Gradkowski, Kamil | en |
dc.contributor.author | Saha, Matthew | en |
dc.contributor.author | Leenheer, Andrew | en |
dc.contributor.author | Chen, Kevin | en |
dc.contributor.author | Gilbert, Gerald | en |
dc.contributor.author | Eichenfield, Matt | en |
dc.contributor.author | Englund, Dirk | en |
dc.contributor.author | O’Brien, Peter | en |
dc.date.accessioned | 2025-03-20T16:25:30Z | |
dc.date.available | 2025-03-20T16:25:30Z | |
dc.date.issued | 2024 | en |
dc.description.abstract | We demonstrate a robust packaging method for PICs using surface grating couplers. We use this method to create diamond color center quantum memory modules with active photon routing, strain tuning, and operation to millikelvin temperatures. | en |
dc.description.status | Peer reviewed | en |
dc.description.version | Published Version | en |
dc.format.mimetype | application/pdf | en |
dc.identifier.articleid | FTh1D.2 | en |
dc.identifier.citation | Bernson, R., Witte, A., Clark, G., Gradkowski, K., Saha, M., Leenheer, A., Chen, K., Gilbert, G., Eichenfield, M., Englund, D. and O’Brien, P. (2024) 'Cryogenic packaging for scalable hybrid quantum PICs', Frontiers in Optics + Laser Science 2024 (FiO, LS), Denver, Colorado, United States, 23–26 September 2024. Technical Digest Series, FTh1D.2 (2pp). https://doi.org/10.1364/FIO.2024.FTh1D.2 | en |
dc.identifier.doi | https://doi.org/10.1364/FIO.2024.FTh1D.2 | en |
dc.identifier.endpage | 2 | en |
dc.identifier.isbn | 978-1-957171-95-1 | en |
dc.identifier.journaltitle | Technical Digest Series | en |
dc.identifier.startpage | 1 | en |
dc.identifier.uri | https://hdl.handle.net/10468/17193 | |
dc.language.iso | en | en |
dc.publisher | Optica Publishing Group | en |
dc.relation.ispartof | Frontiers in Optics + Laser Science 2024 (FiO, LS), Denver, Colorado, United States, 23–26 September 2024 | en |
dc.rights | © 2024, the Authors. Published by Optica Publishing Group. | en |
dc.subject | Packaging | en |
dc.subject | PIC | en |
dc.subject | Surface grating couplers | en |
dc.title | Cryogenic packaging for scalable hybrid quantum PICs | en |
dc.type | Conference item | en |
dc.type | proceedings-article | en |