Cryogenic packaging for scalable hybrid quantum PICs

Bernson, Robert; Witte, Alexander; Clark, Genevieve; Gradkowski, Kamil; Saha, Matthew; Leenheer, Andrew; Chen, Kevin; Gilbert, Gerald; Eichenfield, Matt; Englund, Dirk; O’Brien, Peter

Cryogenic packaging for scalable hybrid quantum PICs

Files

fio-2024-fth1d.2 (1).pdf(2.44 MB)

Published Version

Date

2024

Authors

Bernson, Robert

Witte, Alexander

Clark, Genevieve

Gradkowski, Kamil

Saha, Matthew

Leenheer, Andrew

Chen, Kevin

Gilbert, Gerald

Eichenfield, Matt

Englund, Dirk

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Publisher

Optica Publishing Group

Published Version

https://doi.org/10.1364/FIO.2024.FTh1D.2

Abstract

We demonstrate a robust packaging method for PICs using surface grating couplers. We use this method to create diamond color center quantum memory modules with active photon routing, strain tuning, and operation to millikelvin temperatures.

Keywords

Packaging , PIC , Surface grating couplers

Citation

Bernson, R., Witte, A., Clark, G., Gradkowski, K., Saha, M., Leenheer, A., Chen, K., Gilbert, G., Eichenfield, M., Englund, D. and O’Brien, P. (2024) 'Cryogenic packaging for scalable hybrid quantum PICs', Frontiers in Optics + Laser Science 2024 (FiO, LS), Denver, Colorado, United States, 23–26 September 2024. Technical Digest Series, FTh1D.2 (2pp). https://doi.org/10.1364/FIO.2024.FTh1D.2