Sodium silicate as an enabler for wafer bonding of glass substrates and lids
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Accepted Version
Date
2024-06
Authors
Gupta, Parnika
O’Brien, Joseph
Lee, Jun Su
Hwang, How Yuan
Gradkowski, Kamil
Morrissey, Padraic E.
O’Brien, Peter
Journal Title
Journal ISSN
Volume Title
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Published Version
Abstract
The outgassing challenge associated with using polymer-based die-attach adhesives for vacuum seal photonic packages is addressed in this extended abstract. In addition to this, die movement can occur after high temperature anodic bonding of the lid/cap wafer and substrate wafer due to low glass transition temperature of polymer based adhesive systems. This presents a challenge for photonic packages where photonic chip’s positional accuracy is critical. Silicate based adhesives are presented as a solution to enable vacuum seal packaging of photonic chips.
Description
Keywords
Sodium silicate , Lid wafer , Wafer bonding , Curing , Photonic package
Citation
Gupta, P., O’Brien, J., Lee, J. S., Hwang, H. Y., Gradkowski, K., Morrissey, P. E. and O’Brien, P. (2024) 'Sodium silicate as an enabler for wafer bonding of glass substrates and lids', NordPac 2024, Tampere, Finland, June 11-13.
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© 2024, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.