Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing

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dc.contributor.authorGradkowski, Kamilen
dc.contributor.authorWang, Hsiang-Chuen
dc.contributor.authorKumar, Das S.en
dc.contributor.authorCollins, Seanen
dc.contributor.authorButler, Sharonen
dc.contributor.authorHwang, How-Yuanen
dc.contributor.authorNoell, Wilfrieden
dc.contributor.authorShortiss, Kevinen
dc.contributor.authorParra, Josueen
dc.contributor.authorFiol, Gerriten
dc.contributor.authorVelthaus, Karl-Otooen
dc.contributor.authorO'Brien, Peteren
dc.contributor.editorSchröder, Henningen
dc.contributor.editorChen, Ray T.en
dc.contributor.funderHorizon 2020en
dc.date.accessioned2025-05-20T15:19:51Z
dc.date.available2025-05-20T15:19:51Z
dc.date.issued2025-03-20en
dc.description.abstractWe present a photonic packaging paradigm where the light from an edge coupler of a photonic integrated circuit is turned normal to the surface using a specially-manufactured silicon micro-lens equipped with an etched turning prism. Due to expansion of the beam, the alignment tolerances of coupling to similarly-equipped fiber array are significantly relaxed making it compatible with the future surface-mounted pluggable solutions. We demonstrate sub-2 dB coupling efficiency at 1310 nm from a transceiver chip.en
dc.description.sponsorshipHorizon 2020 (10101673)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationGradkowski, K., Wang, H. C., Kumar, D. S., Collins, S., Butler, S., Hwang, H. Y., Noell, W., Shortiss, K., Parra, J., Fiol, G. and Velthaus, K. O. (2025) 'Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing', Optical Interconnects and Packaging 2025, Fort Collins, Colorado, June 16 - 18, Proceedings of SPIE, 13372, pp.77-83. https://doi.org/10.1117/12.3042451en
dc.identifier.doi10.1117/12.3042451en
dc.identifier.endpage83en
dc.identifier.journaltitleProceedings of SPIEen
dc.identifier.startpage77en
dc.identifier.urihttps://hdl.handle.net/10468/17546
dc.identifier.volume13372en
dc.language.isoenen
dc.publisherSPIEen
dc.relation.ispartofOptical Interconnects and Packaging 2025, Fort Collins, Colorado, June 16 - 18en
dc.relation.project10101673en
dc.rights© 2025, Society of Photo Optical Instrumentation Engineers (SPIE). One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.en
dc.subjectPhotonic integrated circuitsen
dc.subjectPhotonic packagingen
dc.subjectMicro-opticsen
dc.subjectExpanded beam connectorsen
dc.subjectScalable packagingen
dc.titleRecent advances in fiber-to-PIC packaging technologies for scalable manufacturingen
dc.typeConference itemen
dc.typeproceedings-articleen
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