Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing
Loading...
Date
2025-03-20
Authors
Gradkowski, Kamil
Wang, Hsiang-Chu
Kumar, Das S.
Collins, Sean
Butler, Sharon
Hwang, How-Yuan
Noell, Wilfried
Shortiss, Kevin
Parra, Josue
Fiol, Gerrit
Journal Title
Journal ISSN
Volume Title
Publisher
SPIE
Published Version
Abstract
We present a photonic packaging paradigm where the light from an edge coupler of a photonic integrated circuit is turned normal to the surface using a specially-manufactured silicon micro-lens equipped with an etched turning prism. Due to expansion of the beam, the alignment tolerances of coupling to similarly-equipped fiber array are significantly relaxed making it compatible with the future surface-mounted pluggable solutions. We demonstrate sub-2 dB coupling efficiency at 1310 nm from a transceiver chip.
Description
Keywords
Photonic integrated circuits , Photonic packaging , Micro-optics , Expanded beam connectors , Scalable packaging
Citation
Gradkowski, K., Wang, H. C., Kumar, D. S., Collins, S., Butler, S., Hwang, H. Y., Noell, W., Shortiss, K., Parra, J., Fiol, G. and Velthaus, K. O. (2025) 'Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing', Optical Interconnects and Packaging 2025, Fort Collins, Colorado, June 16 - 18, Proceedings of SPIE, 13372, pp.77-83. https://doi.org/10.1117/12.3042451
Link to publisher’s version
Copyright
© 2025, Society of Photo Optical Instrumentation Engineers (SPIE). One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.