Thin silicon in a novel 3-D format for implementation in distributed autonomous micro modules
| dc.contributor.author | Cussen, Teresa | |
| dc.contributor.author | Majeed, Bivragh | |
| dc.contributor.author | Delaney, Kieran | |
| dc.contributor.author | Ó Mathúna, S. Cian | |
| dc.date.accessioned | 2019-05-27T14:14:12Z | |
| dc.date.available | 2019-05-27T14:14:12Z | |
| dc.date.issued | 2002-09 | |
| dc.date.updated | 2019-05-27T14:07:48Z | |
| dc.description.abstract | Silicon thinning, interconnection and packaging are key innovative hardware technologies that can be used to realise distributed autonomous micro-modules (DAMM) for future ad-hoc networks in ambient systems and intelligent environments. These would interact, respond and learn from their surroundings making integration of engineering, computer science and human intelligence a reality. This paper investigates thinning silicon sensors and packaging these sensors in a tetrahedral format. This form was chosen because it is vastly expandable and when miniaturised can be used as a building block for DAMM’s, which can be designed to physically integrate into materials from which artefacts are fabricated. | en |
| dc.description.status | Peer reviewed | en |
| dc.description.version | Published Version | en |
| dc.format.mimetype | application/pdf | en |
| dc.identifier.citation | Cussen, T., Majeed, B., Delaney, K. and Ó Mathuna, S. Cian (2002) 'Thin Silicon in a Novel 3-D Format for Implementation in Distributed Autonomous Micro Modules', UbiComp 2002: Fourth International Conference on Ubiquitous Computing, Goteberg, Sweden, 29 September - 1 October, pp. 49-50. | en |
| dc.identifier.endpage | 50 | en |
| dc.identifier.startpage | 49 | en |
| dc.identifier.uri | https://hdl.handle.net/10468/7983 | |
| dc.language.iso | en | en |
| dc.publisher | Viktoria Institute, Göteborg, Sweden | en |
| dc.relation.ispartof | UbiComp 2002: Fourth International Conference on Ubiquitous Computing | |
| dc.relation.uri | http://www.ubicomp.org/ubicomp2002/ubicomp_adjunct_proceedings.pdf | |
| dc.rights | © 2002 The Authors. | en |
| dc.subject | Thin silicon | en |
| dc.subject | 3-D packaging | en |
| dc.subject | Flip chip | en |
| dc.subject | Micro-modules | en |
| dc.title | Thin silicon in a novel 3-D format for implementation in distributed autonomous micro modules | en |
| dc.type | Conference item | en |
