Thermal and electrical study of glass interposers in co-packaged electronic-photonic systems
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Date
2025-01-23
Authors
Gupta, Parnika
Mallik, Arun Kumar
Krohnert, Kevin
Latkowski, Sylwester
Okonkwo, Chigo
Alomari, Saif
Kumar, Das Soumitra
Gradkowski, Kamil
Morrissey, Padraic E.
O’Brien, Peter
Journal Title
Journal ISSN
Volume Title
Publisher
IEEE
Published Version
Abstract
This paper investigates the use of glass interposers as a scalable and cost-effective solution for co-packaged electronic-photonic systems, with a focus on optimizing thermal management and electrical transmission. The thermal management study is carried out through design, assembly and characterization of a thermal test vehicle. The thermal test vehicle is used to study the heat dissipation in glass interposers by varying the Through Glass Via (TGV) pitch (100 μm to 400 μm). The outcomes indicate a maximum surface temperature rise of 2.9 °C, which is also confirmed by finite element method simulations. Moreover, the simulations also suggest that changes in TGV pitch below 100 μm do not significantly impact the temperature variation. The electrical transmission through the glass interposer package is investigated using three different design scenarios (Transmission Lines on Glass, Glass Interposer and Electrical Test Vehicle). The RF performance of each design is studied up to 40 GHz to analyze the losses incurred by different components in the package. In conclusion, this work presents an optimized electrical design for the test vehicle. By employing strategically designed geometries for TGVs, microvias, and ball grid array (BGA) pads, we achieved a significant reduction in insertion loss of approximately 11 dB at 40 GHz. This design approach can be compatible with 2.5D and 3D integration schemes, enabling high-density and high-performance electronic-photonic packages.
Description
Keywords
Co-packaging , Thermal management , Electrical design , Glass interposer , Through glass vias , Reference thermal chip
Citation
Gupta, P., Mallik, A. K., Krohnert, K., Latkowski, S., Okonkwo, C., Alomari, S., Kumar, D. S., Gradkowski, K., Morrissey, P. E. and O’Brien, P. (2025) 'Thermal and electrical study of glass interposers in co-packaged electronic-photonic systems', IEEE Transactions on Components, Packaging and Manufacturing Technology. https://doi.org/10.1109/TCPMT.2025.3533388
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