Thermal and electrical study of glass interposers in co-packaged electronic-photonic systems

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dc.contributor.authorGupta, Parnikaen
dc.contributor.authorMallik, Arun Kumaren
dc.contributor.authorKrohnert, Kevinen
dc.contributor.authorLatkowski, Sylwesteren
dc.contributor.authorOkonkwo, Chigoen
dc.contributor.authorAlomari, Saifen
dc.contributor.authorKumar, Das Soumitraen
dc.contributor.authorGradkowski, Kamilen
dc.contributor.authorMorrissey, Padraic E.en
dc.contributor.authorO’Brien, Peteren
dc.contributor.funderHorizon 2020en
dc.date.accessioned2025-03-03T16:12:50Z
dc.date.available2025-03-03T16:12:50Z
dc.date.issued2025-01-23en
dc.description.abstractThis paper investigates the use of glass interposers as a scalable and cost-effective solution for co-packaged electronic-photonic systems, with a focus on optimizing thermal management and electrical transmission. The thermal management study is carried out through design, assembly and characterization of a thermal test vehicle. The thermal test vehicle is used to study the heat dissipation in glass interposers by varying the Through Glass Via (TGV) pitch (100 μm to 400 μm). The outcomes indicate a maximum surface temperature rise of 2.9 °C, which is also confirmed by finite element method simulations. Moreover, the simulations also suggest that changes in TGV pitch below 100 μm do not significantly impact the temperature variation. The electrical transmission through the glass interposer package is investigated using three different design scenarios (Transmission Lines on Glass, Glass Interposer and Electrical Test Vehicle). The RF performance of each design is studied up to 40 GHz to analyze the losses incurred by different components in the package. In conclusion, this work presents an optimized electrical design for the test vehicle. By employing strategically designed geometries for TGVs, microvias, and ball grid array (BGA) pads, we achieved a significant reduction in insertion loss of approximately 11 dB at 40 GHz. This design approach can be compatible with 2.5D and 3D integration schemes, enabling high-density and high-performance electronic-photonic packages.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationGupta, P., Mallik, A. K., Krohnert, K., Latkowski, S., Okonkwo, C., Alomari, S., Kumar, D. S., Gradkowski, K., Morrissey, P. E. and O’Brien, P. (2025) 'Thermal and electrical study of glass interposers in co-packaged electronic-photonic systems', IEEE Transactions on Components, Packaging and Manufacturing Technology. https://doi.org/10.1109/TCPMT.2025.3533388en
dc.identifier.doihttps://doi.org/10.1109/TCPMT.2025.3533388en
dc.identifier.eissn2156-3985en
dc.identifier.issn2156-3950en
dc.identifier.journaltitleIEEE Transactions on Components, Packaging and Manufacturing Technologyen
dc.identifier.urihttps://hdl.handle.net/10468/17142
dc.language.isoenen
dc.publisherIEEEen
dc.relation.ispartofIEEE Transactions on Components, Packaging and Manufacturing Technologyen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::IA/731954/EU/Photonic Integrated Circuits Assembly and Packaging Pilot Line/PIXAPPen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::RIA/101016738/EU/Photonic Wafer-Level Integration Packaging and Test/PhotonicLEAPen
dc.rights© 2025, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectCo-packagingen
dc.subjectThermal managementen
dc.subjectElectrical designen
dc.subjectGlass interposeren
dc.subjectThrough glass viasen
dc.subjectReference thermal chipen
dc.titleThermal and electrical study of glass interposers in co-packaged electronic-photonic systemsen
dc.typeArticle (peer-reviewed)en
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