On-chip microwave photonic system through multi-component micro-transfer print integration
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Accepted Version
Date
2024-11-04
Authors
Atar, Fatih Bilge
Arafat, Yeasir
Mishra, Darpan
O'Callaghan, James
Piwonski, Tomasz
Waqas, Abi
Moynihan, Owen
Dominguez, Diego
Roycroft, Brendan
Gunning, Fatima
Journal Title
Journal ISSN
Volume Title
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published Version
Abstract
We demonstrated a photonic integrated circuit (PIC) with heterogeneously integrated InP-based lasers and uni-travelling carrier photodiodes (UTC-PD) for microwave photonics applications. The InP components are integrated via the micro-transfer printing (MTP) technique, which allows scalable manufacturing process of the microwave photonic chips. We used the photonic circuit to form an external cavity with the transfer printed laser device and achieved tunable single frequency lasing for use in heterodyne radio frequency (RF) generation. The heterogeneously integrated UTC-PDs had 80 GHz bandwidth, and we validated RF generation on UTC-PD with the emission from an on-chip laser.
Description
Keywords
Integrated microwave photonics , Heterogeneous integration , Micro-transfer printing
Citation
Atar, F. B., Arafat, Y., Mishra, D., O'Callaghan, J., Piwonski, T., Waqas, A., Moynihan, O., Dominguez, D., Roycroft, B., Gunning, F., Thomas, K., Pelucchi, E. and Corbett, B. (2024) 'On-chip microwave photonic system through multi-component micro-transfer print integration', 2024 International Topical Meeting on Microwave Photonics (MWP), Pisa, Italy, 17-20 September 2024, pp. 1-4. https://doi.org/10.1109/MWP62612.2024.10736314
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