On-chip microwave photonic system through multi-component micro-transfer print integration

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dc.contributor.authorAtar, Fatih Bilgeen
dc.contributor.authorArafat, Yeasiren
dc.contributor.authorMishra, Darpanen
dc.contributor.authorO'Callaghan, Jamesen
dc.contributor.authorPiwonski, Tomaszen
dc.contributor.authorWaqas, Abien
dc.contributor.authorMoynihan, Owenen
dc.contributor.authorDominguez, Diegoen
dc.contributor.authorRoycroft, Brendanen
dc.contributor.authorGunning, Fatimaen
dc.contributor.authorThomas, Kevinen
dc.contributor.authorPelucchi, Emanueleen
dc.contributor.authorCorbett, Brianen
dc.contributor.funderEnterprise Irelanden
dc.contributor.funderScience Foundation Irelanden
dc.contributor.funderHORIZON EUROPE Marie Sklodowska-Curie Actionsen
dc.date.accessioned2024-12-17T12:56:45Z
dc.date.available2024-12-17T12:56:45Z
dc.date.issued2024-11-04en
dc.description.abstractWe demonstrated a photonic integrated circuit (PIC) with heterogeneously integrated InP-based lasers and uni-travelling carrier photodiodes (UTC-PD) for microwave photonics applications. The InP components are integrated via the micro-transfer printing (MTP) technique, which allows scalable manufacturing process of the microwave photonic chips. We used the photonic circuit to form an external cavity with the transfer printed laser device and achieved tunable single frequency lasing for use in heterodyne radio frequency (RF) generation. The heterogeneously integrated UTC-PDs had 80 GHz bandwidth, and we validated RF generation on UTC-PD with the emission from an on-chip laser.en
dc.description.sponsorshipEnterprise Ireland (Project DT/2019/0080 TAPESTRY)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationAtar, F. B., Arafat, Y., Mishra, D., O'Callaghan, J., Piwonski, T., Waqas, A., Moynihan, O., Dominguez, D., Roycroft, B., Gunning, F., Thomas, K., Pelucchi, E. and Corbett, B. (2024) 'On-chip microwave photonic system through multi-component micro-transfer print integration', 2024 International Topical Meeting on Microwave Photonics (MWP), Pisa, Italy, 17-20 September 2024, pp. 1-4. https://doi.org/10.1109/MWP62612.2024.10736314en
dc.identifier.doi10.1109/MWP62612.2024.10736314en
dc.identifier.eissn2768-346Xen
dc.identifier.endpage4en
dc.identifier.isbn979-8-3503-7539-8en
dc.identifier.isbn979-8-3503-7540-4en
dc.identifier.issn2835-3501en
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/16728
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.ispartof2024 International Topical Meeting on Microwave Photonics (MWP), Pisa, Italy, 17-20 September 2024en
dc.relation.projectinfo:eu-repo/grantAgreement/SFI/SFI Research Centres Programme::Phase 2/12/RC/2276_P2/IE/IPIC_Phase 2/en
dc.relation.projectinfo:eu-repo/grantAgreement/EC/HE::HORIZON-TMA-MSCA-DN-ID/101073138/EU/MicroWave Photonic Technologies for Communications and Sensing Applications in Space/MWP4SPACEen
dc.rights© 2024, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectIntegrated microwave photonicsen
dc.subjectHeterogeneous integrationen
dc.subjectMicro-transfer printingen
dc.titleOn-chip microwave photonic system through multi-component micro-transfer print integrationen
dc.typeConference itemen
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