Micro-transfer-printing: Alternative to polymeric adhesive bonding
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Date
2026-06-09
Authors
Hwang, How Yuan
Lee, Jun Su
Orvietani, Mattia
Zarebidaki, Homa
Morrissey, Padraic
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Abstract
This extended abstract studied the use of spin-on-glass (SOG) for micro-transfer-printing (μTP), as an alternative to conventional polymeric adhesive such as BCB and Intervia. Once cured, SOG behaves as transparent oxide layer and is suitable for rugged environments. The authors demonstrated the μTP of both 200 nm thick lithium niobate films and 3.2 μm thick a-Si cladded lithium niobate chiplets on SOG layer as thin as 50 nm.
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Keywords
Micro-transfer-printing , Spin-on-glass , Thin film photonics , Rugged environment , Glass interposer , [Tyndall]
Citation
Hwang, H Y, Lee, J S, Orvietani, M, Zarebidaki, H & Morrissey, P 2026, 'Micro-transfer-printing: Alternative to polymeric adhesive bonding', 2026 IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac , Stockholm, Sweden, 9/06/26 - 11/06/26 pp. 1-3.
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Copyright
© 2026, the Authors.