Micro-transfer-printing: Alternative to polymeric adhesive bonding

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dc.contributor.authorHwang, How Yuan
dc.contributor.authorLee, Jun Su
dc.contributor.authorOrvietani, Mattia
dc.contributor.authorZarebidaki, Homa
dc.contributor.authorMorrissey, Padraic
dc.contributor.funderHorizon Europe
dc.contributor.funderTaighde Éireann - Research Ireland
dc.date.accessioned2026-05-20T16:00:01Z
dc.date.available2026-05-20T16:00:01Z
dc.date.issued2026-06-09
dc.description.abstractThis extended abstract studied the use of spin-on-glass (SOG) for micro-transfer-printing (μTP), as an alternative to conventional polymeric adhesive such as BCB and Intervia. Once cured, SOG behaves as transparent oxide layer and is suitable for rugged environments. The authors demonstrated the μTP of both 200 nm thick lithium niobate films and 3.2 μm thick a-Si cladded lithium niobate chiplets on SOG layer as thin as 50 nm.en
dc.description.sponsorshipThe authors acknowledge funding from Horizon Europe under the grant agreement No. 101070441 (LOLIPOP) for the lithium niobate film development and Research Ireland under grant number 12/RC/2276 for optical glass interposer development.
dc.description.versionAccepted Version
dc.format.extent3
dc.format.mimetypeapplication/pdfen
dc.identifier.authororcidHwang, How Yuan§0000-0002-8536-0974
dc.identifier.authororcidLee, Jun Su
dc.identifier.authororcidOrvietani, Mattia
dc.identifier.authororcidZarebidaki, Homa
dc.identifier.authororcidMorrissey, Padraic§0000-0002-3876-7317
dc.identifier.citationHwang, H Y, Lee, J S, Orvietani, M, Zarebidaki, H & Morrissey, P 2026, 'Micro-transfer-printing: Alternative to polymeric adhesive bonding', 2026 IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac , Stockholm, Sweden, 9/06/26 - 11/06/26 pp. 1-3.
dc.identifier.endpage3
dc.identifier.otherORCID: /0000-0002-8536-0974/work/215305343
dc.identifier.startpage1
dc.identifier.urihttps://hdl.handle.net/10468/18803
dc.language.isoen
dc.rights© 2026, the Authors.
dc.rights.accessrightsopen access
dc.statusNon peer reviewed
dc.subjectMicro-transfer-printing
dc.subjectSpin-on-glass
dc.subjectThin film photonics
dc.subjectRugged environment
dc.subjectGlass interposer
dc.subject[Tyndall]
dc.titleMicro-transfer-printing: Alternative to polymeric adhesive bondingen
dc.typeConference item
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