Power inside - applications and technologies for integrated power in microelectronics

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dc.contributor.authorÓ Mathúna, S. Cian
dc.contributor.authorKulkarni, Santosh
dc.contributor.authorPavlović, Zoran
dc.contributor.authorCasey, Declan P.
dc.contributor.authorRohan, James F.
dc.contributor.authorKelleher, Anne-Marie
dc.contributor.authorMaxwell, Graeme
dc.contributor.authorO'Brien, Joe
dc.contributor.authorMcCloskey, Paul
dc.contributor.funderSeventh Framework Programmeen
dc.date.accessioned2019-03-25T11:47:40Z
dc.date.available2019-03-25T11:47:40Z
dc.date.issued2017-12
dc.date.updated2019-03-25T11:35:39Z
dc.description.abstractThe emergence of miniaturized and integrated Power Supply on Chip (PwrSoC) and Power Supply in Package (PwrSiP) platforms will be enabled by the application of thin-film, integrated magnetics on silicon. A process flow for, and the design of, a thin-film coupled-inductor, switching at 60MHz, is described. Based on the large signal characterization data, measured up to 100MHz, the efficiency of the inductor is calculated to be 91.7% for a power of 0.5W.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationÓ Mathúna, C., Kulkarni, S., Pavlovic, Z., Casey, D., Rohan, J., Kelleher, A., Maxwell, G., Brien, J. O. and McCloskey, P. (2017) 'Power inside — Applications and technologies for integrated power in microelectronics', 2017 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 02-06 December, pp. 3.3.1-3.3.4. doi: 10.1109/IEDM.2017.8268318en
dc.identifier.doi10.1109/IEDM.2017.8268318
dc.identifier.endpage3.3.4en
dc.identifier.isbn978-1-5386-3559-9
dc.identifier.issn2156-017X
dc.identifier.journaltitle2017 IEEE International Electron Devices Meeting (IEDM)en
dc.identifier.startpage3.3.1en
dc.identifier.urihttps://hdl.handle.net/10468/7673
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.ispartof2017 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)
dc.relation.projectinfo:eu-repo/grantAgreement/EC/FP7::SP1::ICT/318529/EU/POWER SoC With Integrated PassivEs/POWERSWIPEen
dc.relation.urihttps://ieeexplore.ieee.org/document/8268318
dc.rights© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectInductorsen
dc.subjectPower system managementen
dc.subjectMagnetic coresen
dc.subjectInductanceen
dc.subjectWindingsen
dc.subjectSystem-on-chipen
dc.subjectInductorsen
dc.subjectPower supply circuitsen
dc.subjectSiliconen
dc.subjectSystem-on-chipen
dc.subjectIntegrated magneticsen
dc.subjectMicroelectronicsen
dc.subjectIntegrated power supply on chipen
dc.subjectPwrSoCen
dc.subjectPower supply in package platformsen
dc.subjectPwrSiP platformsen
dc.subjectThin-film coupled-inductoren
dc.subjectFrequency 60.0 MHzen
dc.subjectFrequency 100.0 MHzen
dc.titlePower inside - applications and technologies for integrated power in microelectronicsen
dc.typeConference itemen
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