Multi-micron silicon photonicsplatform for highly manufacturable and versatile photonic integrated circuits
dc.contributor.author | Zilkie, A. J. | |
dc.contributor.author | Srinivasan, P. | |
dc.contributor.author | Trita, A. | |
dc.contributor.author | Schrans, T. | |
dc.contributor.author | Yu, G. | |
dc.contributor.author | Byrd, J. | |
dc.contributor.author | Nelson, D. A. | |
dc.contributor.author | Muth, K. | |
dc.contributor.author | Lerose, D. | |
dc.contributor.author | Alalusi, M. | |
dc.contributor.author | Masuda, K. | |
dc.contributor.author | Ziebell, M. | |
dc.contributor.author | Abediasl, H. | |
dc.contributor.author | Drake, J. | |
dc.contributor.author | Miller, G. | |
dc.contributor.author | Nykanen, H. | |
dc.contributor.author | Kho, E. | |
dc.contributor.author | Liu, Y. | |
dc.contributor.author | Liang, H. | |
dc.contributor.author | Yang, H. | |
dc.contributor.author | Peters, Frank H. | |
dc.contributor.author | Nagra, A. S. | |
dc.contributor.author | Rickman, A. G. | |
dc.contributor.funder | Tekes | en |
dc.contributor.funder | Business Finland | en |
dc.date.accessioned | 2020-03-11T16:37:44Z | |
dc.date.available | 2020-03-11T16:37:44Z | |
dc.date.issued | 2019-04-15 | |
dc.date.updated | 2020-03-11T16:30:26Z | |
dc.description.abstract | We describe and characterize a multi-micron silicon photonics platform that was designed to combine performance, power efficiency, manufacturability, and versatility for integrated photonic applications ranging from data communications to sensors. We outline the attributes needed for broad applicability, high-volume manufacturing, and large-scale deployment of silicon photonics, and describe how the platform is favorable with respect to these attributes. We present demonstrations of key technologies needed for the communications and sensing applications, including low-loss fiber attach, compact low-loss filters, efficient hybrid wavelength division multiplexed lasers, and high-speed electro-absorption modulators and integrated photodetectors. | en |
dc.description.sponsorship | Business Finland and Tekes (under projects DEEPSIMOD, grant 5910/31/2017, project RAPSI, grant 55388, and project OPEC, grant 2814/31/2015) | en |
dc.description.status | Peer reviewed | en |
dc.description.version | Accepted Version | en |
dc.format.mimetype | application/pdf | en |
dc.identifier.articleid | 8200713 | en |
dc.identifier.citation | Zilkie, A. J., Srinivasan, P., Trita, A., Schrans, T., Yu, G., Byrd, J., Nelson, D. A., Muth, K., Lerose, D., Alalusi, M., Masuda, K., Ziebell, M., Abediasl, H., Drake, J., Miller, G., Nykanen, H., Kho, E., Liu, Y., Liang, H., Yang, H., Peters, F. H., Nagra, A. S. and Rickman, A. G. (2019) 'Multi-Micron Silicon Photonics Platform for Highly Manufacturable and Versatile Photonic Integrated Circuits', IEEE Journal of Selected Topics in Quantum Electronics, 25(5), pp. 1-13. doi: 10.1109/JSTQE.2019.2911432 | en |
dc.identifier.doi | 10.1109/JSTQE.2019.2911432 | en |
dc.identifier.endpage | 13 | en |
dc.identifier.issn | 1558-4542 | |
dc.identifier.issued | 5 | en |
dc.identifier.journaltitle | IEEE Journal of Selected Topics In Quantum Electronics | en |
dc.identifier.startpage | 1 | en |
dc.identifier.uri | https://hdl.handle.net/10468/9757 | |
dc.identifier.volume | 25 | en |
dc.language.iso | en | en |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | en |
dc.relation.uri | https://ieeexplore.ieee.org/document/8691800 | |
dc.rights | © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | en |
dc.subject | Electroabsorption | en |
dc.subject | Electro-optical modulation | en |
dc.subject | Elemental semiconductors | en |
dc.subject | Fibre optic sensors | en |
dc.subject | Integrated optoelectronics | en |
dc.subject | Optical fibre communication | en |
dc.subject | Optical fibre filters | en |
dc.subject | Optical fibre losses | en |
dc.subject | Photodetectors | en |
dc.subject | Semiconductor optical amplifiers | en |
dc.subject | Silicon | en |
dc.subject | Wavelength division multiplexing | en |
dc.subject | Data communications | en |
dc.subject | Power efficiency | en |
dc.subject | Low-loss fiber attach | en |
dc.subject | Compact low-loss filters | en |
dc.subject | Efficient hybrid wavelength division multiplexed lasers | en |
dc.subject | High-speed electro-absorption modulators | en |
dc.subject | Integrated photodetectors | en |
dc.subject | Sensing applications | en |
dc.subject | High-volume manufacturing | en |
dc.subject | Integrated photonic applications | en |
dc.subject | Multimicron silicon photonics platform | en |
dc.subject | Versatile photonic integrated circuits | en |
dc.subject | Highly manufacturable integrated circuits | en |
dc.subject | Si | en |
dc.subject | Photonics | en |
dc.subject | Micrometers | en |
dc.subject | Optical fiber polarization | en |
dc.subject | Optical losses | en |
dc.subject | Ribs | en |
dc.subject | Photonic integrated circuits | en |
dc.subject | integrated optics | en |
dc.subject | Silicon photonics | en |
dc.subject | Photonic integration | en |
dc.subject | Optical interconnects | en |
dc.subject | Optoelectronics | en |
dc.subject | Hybrid lasers | en |
dc.subject | III-V hybrid integration | en |
dc.title | Multi-micron silicon photonicsplatform for highly manufacturable and versatile photonic integrated circuits | en |
dc.type | Article (peer-reviewed) | en |