Micro-transfer-printing for III-V/Si PICs

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dc.contributor.authorZhang, Jing
dc.contributor.authorOp de Beeck, Camiel
dc.contributor.authorHaq, Bahawal
dc.contributor.authorGoyvaerts, Jeroen
dc.contributor.authorCuyvers, Stijn
dc.contributor.authorKumari, Sulakshna
dc.contributor.authorMuliuk, Grigorij
dc.contributor.authorHermans, Artur
dc.contributor.authorGocalińska, Agnieszka M.
dc.contributor.authorPelucchi, Emanuele
dc.contributor.authorCorbett, Brian
dc.contributor.authorTrindade, Antonio Jose
dc.contributor.authorBower, Chris
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorLepage, Guy
dc.contributor.authorVerheyen, Peter
dc.contributor.authorKuyken, Bart
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorMorthier, Geert
dc.contributor.authorBaets, Roel
dc.contributor.authorRoelkens, Gunther
dc.contributor.funderVlaamse regeringen
dc.contributor.funderHorizon 2020en
dc.date.accessioned2021-04-12T11:44:14Z
dc.date.available2021-04-12T11:44:14Z
dc.date.issued2020-10
dc.date.updated2021-03-18T12:59:44Z
dc.description.abstractMicro-transfer-printing (µTP) enables the intimate integration of a variety of III-V opto-electronic components on silicon photonic integrated circuits (Si PICs). It allows for the scalable manufacturing of complex III-V/Si PICs at low cost.en
dc.description.sponsorshipVlaamse regering (Methusalem funding)en
dc.description.statusPeer revieweden
dc.description.versionPublished Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.articleidT4G.3en
dc.identifier.citationZhang, J., Op de Beeck, C., Haq, B., Goyvaerts, J., Cuyvers, S., Kumari, S., Muliuk, G., Hermans, A., Gocalinska, A., Pelucchi, E., Corbett, B., Trindade, A. J., Bower, C., Van Campenhout, J., Lepage, G., Verheyen, P., Kuyken, B., Van Thourhout, D., Morthier, G., Baets, R. and Roelkens, G. (2020) ‘Micro-transfer-printing for III-V/Si PICs’, Asia Communications and Photonics Conference 2020, Beijing, China, 24-27 October, Paper T4G.3 (3pp). doi: 10.1364/ACPC.2020.T4G.3en
dc.identifier.doi10.1364/ACPC.2020.T4G.3en
dc.identifier.endpage3en
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/11195
dc.language.isoenen
dc.publisherOptical Society of Americaen
dc.relation.ispartofAsia Communications and Photonics Conference/International Conference on Information Photonics and Optical Communications 2020 (ACP/IPOC)
dc.relation.ispartofHeterogeneous Integration II (T4G) session
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::RIA/688510/EU/High density scalable optically interconnected Tb/s Board/Teraboarden
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::IA/688519/EU/Silicon Nitride Photonic Integrated Circuit Pilot line for Life Science Applications in the Visible Range/PIX4LIFEen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::IA/825453/EU/Micro assembled Terabit/s capable optical transceivers for Datacom applications/Caladanen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::ECSEL-IA/737465/EU/Pilot line for micro-transfer-printing of functional components on wafer level/MICROPRINCEen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::RIA/645314/EU/Transfer-print operations for heterogeneous integration/TOP HITen
dc.rights© 2020, the Authors. Published by the Optical Society of America. All rights reserved.en
dc.subjectMicro-transfer-printingen
dc.subjectµTPen
dc.subjectIII-V opto-electronic componentsen
dc.subjectIII-V/Si PICen
dc.subjectSilicon photonic integrated circuitsen
dc.subjectSi PICsen
dc.titleMicro-transfer-printing for III-V/Si PICsen
dc.typeConference itemen
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