Overview of advanced optical interconnect technologies, processes, and equipment in co-packaged optics

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bicop-2025-tu1a.4.pdf(344.59 KB)
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Date
2025-12-30
Authors
Hall, Matthew L.
Kumar, Das
He, Xiuyun
Shortiss, Kevin
Butler, Sharon
Gradkowski, Kamil
Morrissey, Padraic E.
O'Brien, Peter
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Published Version
10.1364/BICOP.2025.Tu1A.4
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Abstract
An overview of advanced optical interconnects is presented in the context of co-packaged optics, including high-density optical interconnects, 3D printed micro-optics, and novel glass interposer technologies, which are key to overcoming key photonics packaging challenges.
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Keywords
Advanced optical interconnect technologies , [TyndallPhotonics] , Processes , Equipment , Co-packaged optics , Optics , Advanced optical interconnects
Citation
Hall, M L, Kumar, D, He, X, Shortiss, K, Butler, S, Gradkowski, K, Morrissey, P E & O'Brien, P 2025, 'Overview of advanced optical interconnect technologies, processes, and equipment in co-packaged optics', Paper presented at 2025 British and Irish Conference on Optics and Photonics, BICOP 2025, London, United Kingdom, 15/12/25 - 18/12/25 pp. 1-2. https://doi.org/10.1364/BICOP.2025.Tu1A.4
Link to publisher’s version
https://www.scopus.com/pages/publications/105036951066
URI
https://hdl.handle.net/10468/18747
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Tyndall Photonics
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© 2025 The Author(s).