Overview of advanced optical interconnect technologies, processes, and equipment in co-packaged optics

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dc.contributor.authorHall, Matthew L.
dc.contributor.authorKumar, Das
dc.contributor.authorHe, Xiuyun
dc.contributor.authorShortiss, Kevin
dc.contributor.authorButler, Sharon
dc.contributor.authorGradkowski, Kamil
dc.contributor.authorMorrissey, Padraic E.
dc.contributor.authorO'Brien, Peter
dc.contributor.funderIntel Corporation
dc.contributor.funderTyndall
dc.contributor.funderColumbia University, CUINY
dc.contributor.funderDefense Advanced Research Projects Agency, ARPA, R00111830002
dc.contributor.funderHORIZON EUROPE Framework Programme, 101098961-H2020-101016738
dc.date.accessioned2026-05-11T16:00:01Z
dc.date.available2026-05-11T16:00:01Z
dc.date.issued2025-12-30
dc.description.abstractAn overview of advanced optical interconnects is presented in the context of co-packaged optics, including high-density optical interconnects, 3D printed micro-optics, and novel glass interposer technologies, which are key to overcoming key photonics packaging challenges.en
dc.description.sponsorshipThe collaborative project between Tyndall, Intel, and Columbia University on multi-chip modules was partly supported by DARPA under the CHIPS program (R00111830002). The work on high-density optical interconnects is part of the Horizon Europe funded NEUROPIC project (101098961). The work on glass interposer technologies was developed within the PhotonicLEAP project, funded through Horizon Europe (H2020-101016738).
dc.description.versionPublished Version
dc.format.extent2
dc.format.mimetypeapplication/pdfen
dc.identifier.authororcidHall, Matthew L.§0000-0002-6593-3210
dc.identifier.authororcidKumar, Das
dc.identifier.authororcidHe, Xiuyun
dc.identifier.authororcidShortiss, Kevin
dc.identifier.authororcidButler, Sharon
dc.identifier.authororcidGradkowski, Kamil§0000-0003-3405-6347
dc.identifier.authororcidMorrissey, Padraic E.§0000-0002-3876-7317
dc.identifier.authororcidO'Brien, Peter
dc.identifier.citationHall, M L, Kumar, D, He, X, Shortiss, K, Butler, S, Gradkowski, K, Morrissey, P E & O'Brien, P 2025, 'Overview of advanced optical interconnect technologies, processes, and equipment in co-packaged optics', Paper presented at 2025 British and Irish Conference on Optics and Photonics, BICOP 2025, London, United Kingdom, 15/12/25 - 18/12/25 pp. 1-2. https://doi.org/10.1364/BICOP.2025.Tu1A.4
dc.identifier.doi10.1364/BICOP.2025.Tu1A.4
dc.identifier.endpage2
dc.identifier.otherORCID: /0000-0003-3405-6347/work/214352263
dc.identifier.otherORCID: /0000-0002-6593-3210/work/214353733
dc.identifier.startpage1
dc.identifier.urihttps://hdl.handle.net/10468/18747
dc.language.isoen
dc.relation.urihttps://www.scopus.com/pages/publications/105036951066
dc.rights© 2025 The Author(s).
dc.rights.accessrightsopen access
dc.statusPeer reviewed
dc.subjectAdvanced optical interconnect technologies
dc.subject[TyndallPhotonics]
dc.subjectProcesses
dc.subjectEquipment
dc.subjectCo-packaged optics
dc.subjectOptics
dc.subjectAdvanced optical interconnects
dc.titleOverview of advanced optical interconnect technologies, processes, and equipment in co-packaged opticsen
dc.typeConference item
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