Overview of advanced optical interconnect technologies, processes, and equipment in co-packaged optics

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dc.contributor.authorHall, Matthew L.
dc.contributor.authorKumar, Das
dc.contributor.authorHe, Xiuyun
dc.contributor.authorShortiss, Kevin
dc.contributor.authorButler, Sharon
dc.contributor.authorGradkowski, Kamil
dc.contributor.authorMorrissey, Padraic E.
dc.contributor.authorO'Brien, Peter
dc.contributor.funderDefense Advanced Research Project Agency
dc.contributor.funderHorizon Europe
dc.date.accessioned2026-05-11T16:00:01Z
dc.date.available2026-05-11T16:00:01Z
dc.date.issued2025-12-30
dc.description.abstractAn overview of advanced optical interconnects is presented in the context of co-packaged optics, including high-density optical interconnects, 3D printed micro-optics, and novel glass interposer technologies, which are key to overcoming key photonics packaging challenges.en
dc.description.sponsorshipThe collaborative project between Tyndall, Intel, and Columbia University on multi-chip modules was partly supported by DARPA under the CHIPS program (R00111830002). The work on high-density optical interconnects is part of the Horizon Europe funded NEUROPIC project (101098961). The work on glass interposer technologies was developed within the PhotonicLEAP project, funded through Horizon Europe (H2020-101016738).
dc.description.versionPublished Version
dc.format.extent2
dc.format.mimetypeapplication/pdfen
dc.identifier.authororcidHall, Matthew L.§0000-0002-6593-3210
dc.identifier.authororcidKumar, Das
dc.identifier.authororcidHe, Xiuyun
dc.identifier.authororcidShortiss, Kevin
dc.identifier.authororcidButler, Sharon
dc.identifier.authororcidGradkowski, Kamil§0000-0003-3405-6347
dc.identifier.authororcidMorrissey, Padraic E.§0000-0002-3876-7317
dc.identifier.authororcidO'Brien, Peter
dc.identifier.citationHall, M L, Kumar, D, He, X, Shortiss, K, Butler, S, Gradkowski, K, Morrissey, P E & O'Brien, P 2025, 'Overview of advanced optical interconnect technologies, processes, and equipment in co-packaged optics', Paper presented at 2025 British and Irish Conference on Optics and Photonics, BICOP 2025, London, United Kingdom, 15/12/25 - 18/12/25 pp. 1-2. https://doi.org/10.1364/BICOP.2025.Tu1A.4
dc.identifier.doi10.1364/BICOP.2025.Tu1A.4
dc.identifier.endpage2
dc.identifier.otherORCID: /0000-0003-3405-6347/work/214352263
dc.identifier.otherORCID: /0000-0002-6593-3210/work/214353733
dc.identifier.startpage1
dc.identifier.urihttps://hdl.handle.net/10468/18747
dc.language.isoen
dc.relation.urihttps://www.scopus.com/pages/publications/105036951066
dc.rights© 2025 The Author(s).
dc.rights.accessrightsopen access
dc.statusPeer reviewed
dc.subjectAdvanced optical interconnect technologies
dc.subject[TyndallPhotonics]
dc.subjectProcesses
dc.subjectEquipment
dc.subjectCo-packaged optics
dc.subjectOptics
dc.subjectAdvanced optical interconnects
dc.titleOverview of advanced optical interconnect technologies, processes, and equipment in co-packaged opticsen
dc.typeConference item
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