Ni, Pt, and Ti stanogermanide formation on Ge0.92Sn0.08
Galluccio, Emmanuele; Petkov, Nikolay; Mirabelli, Gioele; Doherty, Jessica; Lin, Shih-Va; Lu, Fang-Liang; Liu, Chee Wee; Holmes, Justin D.; Duffy, Ray
Date:
2019-04
Copyright:
© 2019, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Citation:
Galluccio, E., Petkov, N., Mirabelli, G., Doherty, J., Lin, S.-V., Lu, F.-L., Liu, C. W., Holmes, J. D. and Duffy, R. (2019) 'Ni, Pt, and Ti stanogermanide formation on Ge0.92Sn0.08', 2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Grenoble, France, 1-3 April. doi: 10.1109/EUROSOI-ULIS45800.2019.9041907
Abstract:
The aim of this work is to provide a systematic and comparative study on the material characteristics and electrical contact performance for a germanium-tin (GeSn) alloy with a high percentage of Sn (8%). Thin metal films (10 nm) of Nickel (Ni), Titanium (Ti), or Platinum (Pt) were deposited on Ge 0.92 Sn 0.08 layers and subsequently annealed at different temperatures ranging from 300°C up to 500°C. Various experimental techniques were employed to characterize the metal morphology and the electrical contact behavior, with the intention of identifying the most promising metal candidate, in terms of low sheet resistance and low surface roughness, considering a low formation temperature. The investigations carried out show that for nano-electronic contact applications, nickel-stanogermanide (NiGeSn) turns out to be the most promising candidate among the three different metals analyzed. NiGeSn presents low sheet resistance combined with low formation temperatures, below 400°C; PtGeSn shows better thermal stability when compared to the other two options while, Ti was found to be unreactive below 500°C, resulting in incomplete TiGeSn formation.
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